Power Converter Busbar Layout for Low Inductance and Heat Dissipation

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Solution Overview

Problem

Existing power conversion devices in electrified vehicles face challenges in reducing size while maintaining performance, leading to increased heat generation and limited output due to the arrangement of power modules and capacitors.

Innovation Solution

The power conversion device incorporates a DC connection member thermally connected to a cooling surface, along with a power module and capacitor strategically arranged to enhance heat dissipation and output, while reducing inductance and size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the size of power module and capacitor are reduced, then the projected area is reduced, but the degree of freedom of directions in which wiring components are led out is reduced making connection complicated

Engineering Contradiction:
Improveprojected areaVSAvoidconnection complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent transitions from a two-dimensional planar arrangement to a three-dimensional spatial arrangement by vertically stacking the power module and capacitor. This dimensional change allows wiring components to be led out in multiple directions (front, rear, left, right sides) without increasing the projected area, thereby resolving the contradiction between compactness and connection flexibility.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs a nested arrangement where the capacitor is positioned adjacent to and integrated with the power module in a compact configuration. This nesting allows multiple components to occupy overlapping or adjacent spatial zones, enabling complex wiring connections to be achieved within a reduced projected area.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Power

If PN terminals and PN stacked busbar are provided above the power module, then inductance is reduced, but heat generated at the PN stacked busbar influences members provided therearound

Engineering Contradiction:
ImproveinductanceVSAvoidheat influence
Core Design Contradiction:
PowerVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the DC connection member (PN stacked busbar) from its conventional position above the power module and relocates it to the rear side of the power module. This separation removes the heat-generating component from proximity to other members, eliminating the harmful thermal influence while preserving the low-inductance connection path between the power module and capacitor.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a heat dissipation member as an intermediary between the DC connection member and surrounding components. This mediator facilitates thermal management by conducting heat away from the PN stacked busbar, allowing the low-inductance configuration to be maintained without transmitting harmful heat to adjacent members.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Power

If PN stacked busbar having large area is provided, then inductance is reduced, but heat generation at the PN stacked busbar increases limiting output increase

Engineering Contradiction:
ImproveinductanceVSAvoidheat generation
Core Design Contradiction:
PowerVSLoss of energy

Solution Approach 1:

The patent introduces a heat dissipation member as an intermediary thermally connected to the DC connection member. This mediator conducts heat away from the PN stacked busbar, enabling the busbar to maintain its large area for low inductance while the heat dissipation member manages the thermal load, thus preventing excessive heat generation that would limit output increase.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the thermal management parameters by introducing active or passive heat dissipation mechanisms through the heat dissipation member. This allows the DC connection member to operate at higher currents (increasing output) while the heat dissipation member maintains the thermal parameters within acceptable limits, resolving the contradiction between low inductance and heat generation.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for increased output while effectively suppressing heat generation at the DC connection member, thereby improving the performance and efficiency of the power conversion device.

Implementation Method 1

a housing having a cooler and a cooling surface cooled by the cooler, the power module being thermally connected to the cooling surface

Methodology Applied
Scientific EffectHeat dissipation: Cooling

Implementation Method 2

The DC connection member has an opposed portion opposed to the cooling surface, and at least a part of the opposed portion is thermally connected to the cooling surface

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250150002A1Power conversion device
Publication Date: 2025.05.08 MITSUBISHI ELECTRIC CORP
  • US20250150002A1 patent drawing
  • US20250150002A1 patent drawing
  • US20250150002A1 patent drawing

AI summary

A power conversion device includes a DC connection member, an AC connection member, a power module, a capacitor, a housing having a cooling surface, and a control board. The power module has a module body portion, a DC connection terminal connected to the DC connection member, and an AC connection terminal connected to an AC connection member. The AC connection member and the AC connection terminal are located on one side in a first direction of the module body portion, and the capacitor is located on another side in the first direction of the module body portion. The DC connection terminal is located on one side or another side in the second direction of the module body portion. The DC connection member has an opposed portion opposed to the cooling surface, and at least a part of the opposed portion is thermally connected to the cooling surface.