Interleaved Busbar Plate Cooling for Compact Switchgear Heat Dissipation
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Solution Overview
Problem
Existing switchgear systems face challenges in increasing power density while effectively dissipating heat generated by circuit breaker components, especially in reduced enclosure volumes, where natural airflow is limited and adding copper is costly and space-consuming.
Innovation Solution
The system employs run-in buses, a thermally conductive plate, and a contact assembly to transfer heat generated in the electrical enclosure. The thermally conductive plate is in contact with the run-in buses, and the contact assembly, with interleaved fingers, helps to efficiently transfer heat to cooler structural elements along the enclosure's periphery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If switchgear power density is increased, then the amount of power provided per unit volume is improved, but the heat generated by current flowing through electrical components increases, making it difficult to dissipate heat effectively
Solution Approach 1:
A thermally conductive plate is introduced as an intermediary component between the run-in buses and the enclosure structure. This plate serves as a heat transfer mediator, conducting heat away from the electrical components to the enclosure walls, thereby enabling effective heat dissipation in high power density configurations without compromising thermal performance
Solution Approach 2:
The invention transitions from relying solely on natural convection in the limited three-dimensional space to utilizing the enclosure walls as an extended heat dissipation surface. By conducting heat to the enclosure structure, the system effectively increases the available heat transfer area, allowing higher power density while maintaining acceptable temperature levels
2Volume of stationary object
If the volume of the switchgear enclosure is reduced, then the footprint is improved, but the volume of ambient air within the enclosure is reduced, making it challenging to dissipate heat
Solution Approach 1:
The thermally conductive plate acts as a mediator that transfers heat from the limited internal air volume to the enclosure structure. This allows the system to maintain effective heat dissipation even when the internal air volume is reduced, enabling compact enclosure designs without sacrificing thermal management capability
Solution Approach 2:
The invention replaces reliance on natural convection currents in ambient air with direct thermal conduction through the thermally conductive plate to the enclosure structure. This substitution of heat transfer mechanism allows for reduced enclosure volume while maintaining heat dissipation effectiveness
3Temperature
If copper is added to increase heat dissipation capability, then the thermal conductivity is improved, but more space is consumed within the fixed enclosure volume and the cost increases
Solution Approach 1:
The invention replaces expensive copper components with a more cost-effective thermally conductive plate made from alternative materials. This substitution maintains adequate heat dissipation capability while reducing material cost and freeing up enclosure volume, allowing for more efficient space utilization
Solution Approach 2:
The invention changes the material parameter from copper to an alternative thermally conductive material that provides sufficient thermal conductivity without the same cost and space constraints. This parameter change enables effective heat dissipation while optimizing both volume utilization and cost effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat dissipation, maintaining component temperatures within predetermined limits, even in compact switchgear designs. It allows for increased power density without significant volume increases, reducing the need for copper and associated costs.
Implementation Method 1
The thermally conductive plate is in contact with the run-in buses, and the contact assembly, with interleaved fingers, helps to efficiently transfer heat to cooler structural elements along the enclosure's periphery
Implementation Method 2
heat generated in the run-in buses by conducting a current through the run-in buses
Data Source
AI summary
A system for transferring heat generated in an electrical enclosure includes run-in buses, a thermally conductive plate, and at least one contact assembly secured to the plate. Each pair of adjacent run-in buses is separated by a space. The plate has at least one opening extending therethrough, and the plate receives the run-in buses through the at least one opening. The at least one contact assembly has spaced apart fingers that partially cover the at least one opening of the plate, and adjacent fingers define a slot. Each of the fingers is located in a space between adjacent run-in buses, and each of the run-in buses is located in a slot when the fingers are located in the spaces between adjacent run-in buses. The run-in buses and contact assembly fingers are oriented in an interleaved pattern.