Laminated Busbar Plug-In Region for Low-Loss Soldering
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Solution Overview
Problem
Existing busbars face challenges in energy efficiency during soldering processes due to energy loss through flat conductive layers, leading to increased energy consumption and potential damage to electronic components.
Innovation Solution
A laminated busbar design with a plug-in region featuring a narrow and long bridge section that stores heat energy during soldering, reducing thermal energy dissipation and allowing for higher temperatures in a shorter time, thereby reducing energy requirements and minimizing component exposure to high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional flat conductive layer is used for soldering, then the soldering process can be performed, but a large amount of thermal energy is lost into the flat layers, requiring more energy and longer time
Solution Approach 1:
The conductive layer is designed with non-uniform thickness, creating a localized thick region (protrusion) at the soldering position. This local structural modification concentrates thermal energy where needed while reducing heat dissipation to surrounding areas, directly addressing the energy loss problem in conventional flat conductive layers
Solution Approach 2:
The invention transitions from a two-dimensional flat conductive layer to a three-dimensional structure with vertical protrusions. This dimensional change creates a volumetric heat storage region that captures and retains thermal energy during soldering, preventing energy loss to the surrounding flat layers
2Productivity
If high temperature is applied for soldering in conventional busbars, then the soldering process can be completed, but electronic components are exposed to high temperatures for extended periods, risking damage
Solution Approach 1:
The protrusion creates a localized thermal environment where high temperature is concentrated precisely at the soldering position. This local heat concentration enables rapid soldering while the surrounding areas, including electronic components, remain at lower temperatures, reducing thermal damage risk
Solution Approach 2:
The thick conductive layer protrusion acts as a thermal buffer that quickly absorbs and stores heat energy before it can dissipate to surrounding components. This pre-positioned thermal mass cushions the thermal shock to electronic components while enabling rapid soldering
3Reliability
If adhesive connection is used to connect pins to busbar, then electrical connection is achieved, but curvature protrudes from the flat busbar surface
Solution Approach 1:
The conductive layer is segmented into a flat main body and localized protrusion regions. The protrusions are strategically positioned to accommodate connection elements, while the main body maintains its flat surface. This segmentation allows the connection function to be performed without compromising the overall flat surface integrity
Solution Approach 2:
Connection elements are accommodated in the vertical dimension through protrusions rather than disrupting the horizontal flat surface. This dimensional accommodation allows adhesive connections to be made while preserving the flat external surface of the busbar
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the efficiency of the soldering process by using less energy and reducing the risk of damage to electronic components, while maintaining mechanical stability and compactness.
Implementation Method 1
it is possible to store heat energy in the plug-in region during the soldering process, in particular within the centre section and/or the bridge section
Implementation Method 2
the bridge section, extending between the main body and the centre section
Data Source
Figure 1
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AI summary
A busbar (1), in particular a laminated busbar (1), configured for mounting an electronic component on the busbar (1), in particular a passive electronic component, wherein the busbar (1) comprises a first conductive layer (10) having a main body (3) and at least one plug-in region (30), the at least one plug-in region (30) being configured for inserting a contact element of the electronic component, in particular a pin (2) of the electronic component, into the busbar (1), wherein the plug-in region (30) comprises - a centre section (32) having a receiving recess (31) for receiving the contact element, - a bridge section (8) for connecting the centre section (32) and the main body (3) of the first conductive layer, wherein the bridge section (8), extending between the main body (3) and the centre section (32), has a first length (L1) along its extension direction (E) and a first width (W1), measured along a direction perpendicular to the extension direction (E), wherein a ratio of the first width (W1) to the first length (L1) is smaller than 0.5.