Busbar Raised-Contact Circuit Structure for Leadless Package Connection
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Solution Overview
Problem
The challenge of connecting shortening connection terminals of electronic components to a busbar, particularly in leadless packages, complicates electrical connections.
Innovation Solution
A circuit structure with a first busbar featuring a conductive raised part protruding into an open hole on a wiring board, allowing easy electrical connection of a first connection terminal to the busbar, optionally with a conductive piece bonded to both the raised part and an extension region, reducing electrical resistance and facilitating heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If connection terminals are shortened, then electronic component size is reduced, but electrical connection to busbar becomes difficult
Solution Approach 1:
The busbar is extended vertically upward to form a raised part that protrudes into the open hole of the wiring board. This dimensional change from a flat busbar to a raised structure allows the connection terminal to contact the busbar at a higher position, facilitating electrical connection even when the terminal is short.
Solution Approach 2:
A conductive piece is introduced as an intermediary element that bridges the connection terminal and the raised part of the busbar. The conductive piece makes contact with both the terminal and the raised part, enabling reliable electrical connection when direct contact is difficult.
2Volume of moving object
If connection terminals are shortened, then electronic component size is reduced, but electrical resistance increases
Solution Approach 1:
The raised part of the busbar extends upward into the wiring board's open hole, creating a longer contact path vertically. This allows the connection terminal to establish electrical contact with the busbar at an elevated position, reducing electrical resistance despite the terminal's short length.
3Volume of moving object
If connection terminals are shortened, then electronic component size is reduced, but local temperature increase occurs
Solution Approach 1:
The raised part of the busbar protrudes upward into the wiring board, extending the heat dissipation path vertically. This three-dimensional structure allows heat from the connection terminal to be conducted away more effectively through the raised busbar structure, reducing local temperature increase.
Solution Approach 2:
The conductive piece acts as a thermal intermediary between the connection terminal and the raised busbar. It facilitates heat transfer from the terminal through the conductive piece to the busbar's raised structure, which has greater heat dissipation capacity due to its extended geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy and low-resistance electrical connections while minimizing local temperature increases, enhancing the electrical and thermal performance of the circuit.
Implementation Method 1
a conductive raised part protruding into the open hole from the first busbar, and a first electronic component having a first connection terminal, the first connection terminal being electrically connected to the raised part in the open hole
Implementation Method 2
enhancing the electrical and thermal performance of the circuit
Data Source
AI summary
A circuit structure includes a first busbar, a wiring board located on the first busbar and having an open hole, a conductive raised part protruding into the open hole from the first busbar, and a first electronic component having a first connection terminal located on the wiring board. The first connection terminal is electrically connected to the raised part in the open hole.