Multi-phase Busbar Resin Casting for Cost Reduction

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Solution Overview

Problem

The high costs associated with manufacturing multi-phase busbars due to the extensive use of toxic liquid resins for lamination, which require safety precautions and increase production costs.

Innovation Solution

A method of manufacturing multi-phase busbars where copper plates are coated before resin application, allowing for localized resin casting around pins without a complex mold, reducing handling steps and tooling costs, and using a resin that can cure without vacuum, thus minimizing the need for toxic materials and complex sealing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If liquid resin is applied to each layer for bonding in the lamination process, then the layers are securely bonded together, but production costs significantly increase due to safety precautions required for toxic materials

Engineering Contradiction:
Improvebonding reliabilityVSAvoidproduction cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies preliminary action by pre-coating the copper plates with insulating material before assembly, and by designing the mold to automatically apply resin only at critical bonding locations (pin holes and edges) rather than requiring extensive resin application to each layer. This reduces the quantity of toxic resin needed while maintaining bonding reliability.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention implements local quality by applying resin selectively only at critical locations where bonding is most needed (pin holes and edges), rather than uniformly across entire layers. This localized resin application maintains structural integrity while significantly reducing the amount of toxic material required, thereby lowering production costs and safety requirements.

Inventive Principle:
Principle #3Local quality

2Reliability

If a complex mold is used for resin casting around pins, then complete encapsulation is achieved, but device complexity and tooling costs increase

Engineering Contradiction:
Improveencapsulation completenessVSAvoidmold complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies segmentation by dividing the mold into simple, separable components that can be easily assembled and disassembled. The mold consists of basic elements (mold body, pins, sealing elements) that can be configured for different busbar designs without requiring complex integrated tooling, thereby reducing device complexity while maintaining encapsulation effectiveness.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention implements universality by designing a mold system that can accommodate various busbar configurations and pin arrangements through simple reconfiguration rather than requiring dedicated complex molds for each design. The basic mold structure serves multiple functions (encapsulation, alignment, sealing) and can be adapted to different production needs, reducing overall device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Manufacturing precision

If vacuum casting is used for resin application, then air bubbles are eliminated, but productivity decreases due to additional equipment and process time

Engineering Contradiction:
Improvebubble-free castingVSAvoidproduction speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent applies self-service by designing the mold and resin application process to automatically eliminate air bubbles through gravity-driven resin flow and venting mechanisms built into the mold structure itself, rather than requiring external vacuum equipment. The resin is applied in a manner that allows bubbles to naturally rise and escape, achieving bubble-free casting through the process design rather than additional equipment.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in reduced production costs, higher reliability, and faster assembly with improved mechanical stability against delamination forces, while maintaining the compactness and efficiency of conventional laminated busbars.

Implementation Method 1

which is filled with resin forming a material bridge which mechanically clamps said first and second conducting layers and said first and second rigid insulating layers together

Methodology Applied
Scientific EffectMechanical clamping: Mechanical Fastener

Data Source

PatentEP3556189B1Multi-phase busbar for conducting electric energy and method of manufacturing the same
Publication Date: 2021.08.25 ABB (SCHWEIZ) AG
  • EP3556189B1 patent drawingFigure 1~2
  • EP3556189B1 patent drawingFigure 3~4
  • EP3556189B1 patent drawingFigure 5

AI summary

A multi-phase busbar (1) for conducting electric energy, comprising a first conducting layer (4a) made of a sheet metal which is coated with an electrically insulating material (5), a first conducting pin (16a) mounted to said first conducting layer (4a) which extends in a direction perpendicular to the first conducting layer (4a), a first insulating layer (6a) of a rigid insulating material arranged on said first conducting layer (4a), said first insulating layer (6a) having an opening (10) through which the first conducting pin (1 6a) projects, a second conducting layer (4b) made of a sheet metal which is coated with an electrically insulating material (5), said second conducting layer (4b) comprising a first pinhole (14a) through which said first conducting pin (16a) projects and a second conducting pin (16b) which extends in a direction parallel to said first conducting pin (16a), is characterized in that said opening (10) in said first insulating layer (6a) and said first pinhole (14a) in said second conducting layer (4b) define a common recess (15) through which said first conducting pin (16a) projects, said recess (15) being filled with a resin (17) which forms a material bridge (12) between the first conducting layer (4a) and the second conducting layer (4b), said material bridge (12) mechanically clamping said first conducting layer (4a), said first rigid insulating layer (6a) and said second conducting (4b) layer together.