3D Busbar Routing in Power Converters for Compact Module Clearance
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Solution Overview
Problem
The challenge is to reduce the size of power conversion devices for electric vehicles while ensuring sufficient space for high-output semiconductor modules, which is hindered by the limited space and accuracy issues in connecting capacitor busbars and semiconductor modules.
Innovation Solution
The power conversion device design includes a semiconductor module, a cooler, a control board, and a capacitor module arranged in an overlapped manner, with a connection busbar structure that allows the capacitor busbar to extend along the outer surface of the capacitor case, enabling secure placement of high-output semiconductor modules and reducing the required clearance and insulation distance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the capacitor busbar extends from the capacitor to the side portion of the semiconductor module, then the power conversion device can be downsized, but a space for connection is needed around the semiconductor module, making it difficult to secure space for high-output semiconductor modules
Solution Approach 1:
The capacitor busbar is configured to extend in multiple directions including along the side wall of the capacitor case, utilizing three-dimensional space rather than linear extension. This allows the busbar to reach the semiconductor module while minimizing the footprint and clearance requirements around the module, effectively using vertical and lateral dimensions to reduce horizontal space consumption.
2Ease of manufacture
If the capacitor busbar extends from the capacitor side to the side portion of the semiconductor module, then connection is achieved, but the dimension accuracy of the end part of the capacitor busbar is lowered due to resin sealing, requiring additional clearance
Solution Approach 1:
A connection portion is provided on the capacitor busbar that serves as an intermediary interface for connecting to the semiconductor module. This connection portion is specifically designed with enhanced dimensional accuracy and positioning features, acting as a mediator between the resin-sealed busbar body (which has lower precision) and the semiconductor module connection points, thereby compensating for the dimensional inaccuracies introduced by resin sealing.
3Reliability
If a connection part between the capacitor busbar and the semiconductor module is provided with a predetermined gap for insulation, then insulation distance is ensured, but it becomes difficult to secure space for high-output semiconductor modules
Solution Approach 1:
The connection structure is designed with nested or integrated insulation arrangements where insulation materials are positioned within the existing structural gaps and spaces between the capacitor case, busbar, and semiconductor module housing. This nesting approach provides the required insulation distance without requiring additional external clearance space, as the insulation is embedded within the compact assembly rather than adding to its external dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for a compact power conversion device with increased output, improved assembly ease, and enhanced insulation accuracy, facilitating the integration of high-output semiconductor modules within the limited space constraints.
Implementation Method 1
a cooler (3) having a bottom surface 3b, a top surface 3a, and side surfaces 3c, the top surface being thermally connected to one surface of the semiconductor module
Data Source
AI summary
The power conversion device includes a semiconductor module having a connection terminal, a cooler, a control board, a capacitor module, a cover, a case, and a connection busbar. The semiconductor module, the cooler, the control board, and the capacitor module are arranged in an overlapped manner as seen in the direction perpendicular to the top surface of the cooler. The capacitor module has a capacitor cell, a capacitor case, resin, and a capacitor busbar. The capacitor busbar has an inner extending portion, an opening-side extending portion, and an outer extending portion. The connection busbar extends from the connection terminal of the semiconductor module to an outer surface of the outer extending portion and has a part extending in parallel to the extending direction of the outer extending portion. The connection busbar has a capacitor connection portion at an end thereof on the outer extending portion side.