Busbar Thermal Coupling to Heat Sink in EV Power Electronics
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Solution Overview
Problem
In electric vehicle power electronics circuits, the heating of filter devices due to high supply currents from busbars and connectors leads to elevated component temperatures, reducing their lifespan and necessitating costly temperature-stable components, and existing cooling methods are dependent on housing temperature, limiting flexibility and efficiency.
Innovation Solution
Thermally connecting sections of the busbar to a heat sink, which also cools the power electronics module, reduces the temperature of the filter device components by dissipating heat from the busbar and connector, allowing for the use of components with lower maximum permissible temperatures and eliminating the need for additional thermal connections to the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the filter device components are thermally connected to the housing for heat dissipation, then the heat dissipation capability is improved, but the temperature of the filter device components becomes dependent on the housing temperature, reducing design flexibility
Solution Approach 1:
The patent segments the thermal management system by providing separate thermal connection paths: one through the housing and another through the busbar to a heat sink. This allows independent optimization of each path and decouples the filter device temperature from housing temperature dependencies.
Solution Approach 2:
The busbar serves as an intermediary thermal conduction element between the filter device components and the heat sink. By introducing this intermediate thermal path, the system achieves temperature control independent of the housing thermal state.
2Temperature
If additional cooling measures are implemented for filter device components, then the temperature control is improved, but the device complexity increases
Solution Approach 1:
The busbar performs multiple functions: electrical connection between connector and power electronics, and thermal conduction from filter device components to heat sink. This multi-functionality eliminates the need for separate cooling structures, reducing overall device complexity.
Solution Approach 2:
The patent merges the cooling function with the existing electrical connection structure (busbar). By combining thermal management with the electrical interconnection system, no additional cooling components are required.
3Loss of energy
If the busbar is thermally connected to the heat sink, then the heat dissipation from the busbar is improved, but the thermal management system complexity increases
Solution Approach 1:
The busbar is designed to serve dual purposes: electrical conduction and thermal conduction. This eliminates the need for separate thermal management components, achieving improved heat dissipation without increasing system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the heating of filter device components, improves their lifespan, and allows for flexible use in various configurations by decoupling their temperature from the housing environment, enhancing heat dissipation and assembly simplicity.
Implementation Method 1
the power electronics module and at least one section of the busbar are thermally connected to the heat sink
Implementation Method 2
at least one inductance element which surrounds the connector and/or at least one busbar and has an opening in which the connector and/or the at least one busbar is arranged
Data Source
AI summary
Electrical circuit device comprising a power electronics circuit with at least one power electronics module, a filter device, a heat sink, a connector and at least one busbar, wherein the filter device is at least partially coupled to the busbar and the busbar electrically connects the connector to the power electronics circuit, wherein the power electronics module and at least a portion of the busbar are thermally connected to the heat sink.