Perpendicular Busbar Wiring Module for Compact Battery Pack Soldering
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Solution Overview
Problem
The downsizing of busbar assemblies in high-pressure battery packs for electric or hybrid automobiles reduces the space for mounting sensing circuit boards, making electrical connections between the circuit boards and busbars difficult, such as soldering, which is not easily performed.
Innovation Solution
A wiring module configuration where a busbar is connected to electrode terminals of power storage elements, a circuit board is soldered to the busbar, and a protector holds both, with the busbar and circuit board arrangement surfaces being perpendicular to each other, allowing for efficient soldering even in a downsized format and improving production efficiency by enabling more protectors to be used on a working lane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the busbar assembly is downsized, then the compactness of the high-pressure battery pack is improved, but the space for mounting the sensing circuit board is reduced making electrical connection difficult
Solution Approach 1:
The patent changes the spatial arrangement from a parallel configuration to a perpendicular configuration between the busbar arrangement surface and circuit board arrangement surface. This dimensional change allows the circuit board to be mounted on the side surface of the busbar assembly, effectively utilizing vertical space and enabling electrical connections even in downsized assemblies where horizontal space is limited.
2Volume of moving object
If the busbar assembly is downsized, then the compactness of the high-pressure battery pack is improved, but the space for mounting the sensing circuit board is reduced
Solution Approach 1:
The patent utilizes the side surface of the busbar assembly by arranging the circuit board perpendicular to the busbar arrangement surface. This creates additional mounting area on the lateral surface, effectively increasing the available mounting area without increasing the overall volume of the busbar assembly.
3Productivity
If more protectors are used on the working lane, then the production efficiency is improved, but the space requirement for each protector is increased
Solution Approach 1:
The perpendicular arrangement of the circuit board on the side surface allows protectors to be compact in the horizontal plane while maintaining adequate space for soldering operations. This vertical utilization of space reduces the footprint area occupied by each protector, enabling more protectors to be arranged on the working lane simultaneously, thereby improving production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides sufficient space for electrical connections between busbars and circuit boards in downsized modules, enhancing soldering efficiency and production efficiency by allowing more protectors to be used, while also accommodating thermal expansion and contraction without damaging the solder joint.
Implementation Method 1
a circuit board connected to the busbar with solder
Data Source
AI summary
A wiring module is to be attached to multiple power storage elements. The wiring module includes a busbar connected to electrode terminals of the multiple power storage elements, a circuit board connected to the busbar with solder, and a protector configured to hold the busbar and the circuit board. The protector includes a busbar arrangement surface on which the busbar is disposed and a board arrangement surface on which the circuit board is disposed. The board arrangement surface and the busbar arrangement surface are perpendicular to each other.