Bush-to-Stabilizer Bonding with Dual Heating for Consistent Adhesion
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Solution Overview
Problem
The temperature of the stabilizer during heating is dependent on outside temperature, requiring adjustments in heating conditions by season, leading to increased operation steps and reduced productivity.
Innovation Solution
A bonding method involving adhesive application, preheating with near-infrared lamps, surface treatment, and induction heating to ensure consistent bonding regardless of outside temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heating conditions are adjusted for each season based on outside temperature, then bonding reliability is improved, but the number of operation steps and operating time increase
Solution Approach 1:
The patent applies parameter changes by using a near-infrared lamp to heat the adherend member to a specific temperature range (50°C to 150°C) before adhesive application. This temperature parameter control ensures the adherend member's surface temperature remains within an optimal range regardless of outside temperature variations, eliminating the need for seasonal heating condition adjustments while maintaining bonding reliability
Solution Approach 2:
The patent implements preliminary action by performing heating of the adherend member before adhesive application. The near-infrared lamp preheats the adherend member surface in advance, creating optimal bonding conditions before the adhesive is applied and the buffer member is attached, thereby ensuring consistent bonding results without requiring post-adjustment of heating parameters
2Reliability
If heating time is extended to compensate for low outside temperature, then bonding quality is improved, but operating time increases
Solution Approach 1:
The patent replaces conventional heating methods with near-infrared radiation heating. The near-infrared lamp directly radiates energy to the adherend member, achieving rapid and uniform heating without the time delays associated with conventional heating. This substitution reduces heating time while ensuring the adherend member reaches the optimal temperature range for bonding
Solution Approach 2:
The patent controls the heating temperature parameter within a specific range (50°C to 150°C) using near-infrared radiation. By maintaining the adherend member surface temperature within this optimal range, the bonding quality is ensured while avoiding excessive heating time that would occur with conventional heating methods at lower temperatures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable bonding of a buffer member to a stabilizer while minimizing productivity losses.
Implementation Method 1
the first heating step includes heating the adherend member using a near-infrared lamp
Implementation Method 2
the second heating step includes heating the adherend member by induction heating
Data Source
Figure 1~2
Figure 3(a)~3(h)
Figure 4
AI summary
A bonding method according to the present invention is a bonding method for bonding a bush to an adherend member and includes: an adhesive application step of applying an adhesive to a part of a buffer member, the part being bonded to the adherend member; a first heating step of heating a part of the adherend member, the part being bonded to the buffer member; a second heating step of heating the part of the adherend member after the first heating step; and an attachment step of attaching the buffer member to the adherend member after the second heating step.