Peelable Semiconductor Cable Layer Using Butene Polymer
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Solution Overview
Problem
Existing semiconductor layers in electric cables, particularly those intended for high voltage applications, face issues with degradation at high temperatures, leading to the formation of corrosive residues, increased dielectric loss, unwanted bonding with neighboring materials, and poor adhesion with non-polar layers, which complicates cable preparation and operation.
Innovation Solution
A crosslinked semiconductor layer obtained from a crosslinkable polymer composition comprising at least 15% by weight of a butene polymer, combined with a nonpolar olefin polymer, providing improved peelability, reduced sticking tendencies, and enhanced thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If EVA copolymer is used as semiconductor layer material, then adhesion to polar materials is improved, but thermal degradation occurs at high temperatures leading to corrosive residues and increased dielectric loss
Solution Approach 1:
The patent changes the chemical composition parameters of the semiconductor layer by replacing EVA copolymer with a specific polymer composition containing at least 15% by weight of butene polymer relative to total crosslinkable polymer composition. This parameter change eliminates the vinyl acetate groups that cause thermal degradation while maintaining adhesion properties through the specific polymer blend formulation.
Solution Approach 2:
The invention uses a composite polymer material system comprising multiple components: at least one nonpolar olefin polymer and at least 15% by weight of butene polymer. This composite approach combines the thermal stability of nonpolar olefin polymers with the adhesion properties of butene polymer, resolving the contradiction between thermal stability and adhesion.
2Use of energy by moving object
If polar materials such as EVA or NBR are used in semiconductor layer, then adhesion to polar substrates is improved, but unwanted bonding with neighboring materials occurs during cable preparation
Solution Approach 1:
The patent changes the polarity parameter of the semiconductor layer material by selecting nonpolar olefin polymers and butene polymer instead of polar materials like EVA or NBR. This parameter change reduces unwanted bonding with neighboring materials while the specific composition (≥15% butene polymer) ensures adequate adhesion and controlled peelability for cable preparation operations.
3Use of energy by moving object
If high polarity materials are used in semiconductor layer, then adhesion to polar materials is improved, but dielectric loss factor increases for high voltage cables
Solution Approach 1:
The patent changes the polarity parameter of the semiconductor layer by using nonpolar olefin polymers and butene polymer instead of highly polar materials. This parameter change reduces dielectric loss factor for high voltage cable applications while the specific composition formulation maintains necessary adhesion properties through the polymer blend rather than relying on high polarity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The semiconductor layer exhibits excellent peelability, reduced sticking with neighboring materials, and improved thermal stability, facilitating easier cable preparation and operation while maintaining electrical integrity at high temperatures.
Implementation Method 1
a crosslinked semiconductor layer obtained from a crosslinkable polymer composition comprising at least one nonpolar olefin polymer, and at least 15% by weight of a butene polymer
Data Source
Figure 1
AI summary
The invention relates to an electrical cable comprising a crosslinked semiconducting layer obtained from a crosslinkable polymer composition based on at least one non-polar olefin polymer, and at least 15% by weight of a butene polymer, relative to the total weight of the crosslinkable polymer composition.