Butt-Joint Flex Circuit Interconnection for Durable Signal Bridging
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Solution Overview
Problem
Connecting flex circuit boards is challenging due to their inherent pliability, which increases the risk of damage during handling and use, and makes repair or replacement inconvenient and expensive.
Innovation Solution
A butt joint interconnection method is developed, where flex circuit boards with removed portions exposing signal lines are aligned to form a signal trace gap, secured with a solder bridge and a ground support layer, and covered with an isolation plate, potentially using superconductive materials for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flex circuit boards are used for their flexibility and space efficiency, then adaptability and compactness are improved, but reliability and durability deteriorate due to increased risk of damage during handling and use
Solution Approach 1:
The patent combines multiple flex circuit boards into a rigid assembly through butt joint interconnection with solder bridges and isolation plates. This merging transforms individually fragile flexible boards into a consolidated rigid structure that maintains the flexibility benefits while achieving assembly-level durability and resistance to handling damage.
Solution Approach 2:
The patent implements protective structures including isolation plates positioned between adjacent flex circuit boards and solder bridges that pre-reinforce the connections before use. These elements act as cushioning and reinforcement measures that prevent damage during handling and operation, addressing the durability concern before it arises.
2Reliability
If flex circuit boards are connected through traditional methods, then connectivity is achieved, but structural reinforcement and damage resistance are insufficient
Solution Approach 1:
The patent employs composite construction by combining flex circuit boards with rigid support elements (isolation plates, solder bridges) to create a hybrid structure. This composite approach maintains the electrical connectivity function while adding structural strength and damage resistance that neither component could provide alone.
Solution Approach 2:
The patent introduces isolation plates as intermediary elements between adjacent flex circuit boards. These plates serve as mediators that provide structural reinforcement, prevent direct contact between vulnerable board edges, and enhance overall assembly strength while maintaining proper signal connections through the solder bridges.
3Reliability
If removed portions are created to expose signal lines for interconnection, then connectivity between boards is improved, but vulnerability to damage at the exposed areas increases
Solution Approach 1:
The patent converts the potentially harmful exposed signal line areas into beneficial connection zones by implementing solder bridges that securely join the exposed lines. The isolation plates further protect these areas by preventing external damage while maintaining the necessary electrical connections, thus transforming vulnerability into a controlled and beneficial interconnection interface.
Data Source
AI summary
Interconnections for connecting flex circuit boards in classical and/or quantum computing systems can include a first flex circuit board having a removed portion that exposes one or more signal lines and a second flex circuit board having a removed portion that exposes one or more other signal lines. The flex circuit boards can be aligned at the removed portions to form a signal trace gap near the exposed signal lines. Exposed signal lines of the first flex circuit board can be coupled with exposed signal lines of the second flex circuit board. A ground support layer can be coupled to the first flex circuit board and the second flex circuit board along the same side. An isolation plate at least partially covering the signal trace gap can be coupled to the first flex circuit board and/or the second flex circuit board on a side opposite of the ground support layer.