BVA Interposer Wire Bond Encapsulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current interposers and methods for making them lack improvements in efficiently connecting semiconductor dies to other components, particularly in achieving compact size and high-speed operation, as they often rely on traditional solder-based bonding methods that limit signal propagation time.
Innovation Solution
A method involving the formation of wire bonds with encapsulation, where the wire bonds have extremities not fully covered by the encapsulation, allowing for electrical connection between the interposer's sides, and a dielectric encapsulation separates adjacent wire bonds, enabling efficient electrical connectivity and potential thinning of the interposer for reduced size and faster signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional solder-based bonding methods are used to connect semiconductor dies to other components, then reliable electrical connection is achieved, but signal propagation time increases and assembly size is enlarged
Solution Approach 1:
The patent extracts the bonding function from traditional solder-based methods and implements it through wire bonds that extend through the encapsulation. The wire bonds are directly connected to contact pads on the semiconductor die and extend beyond the encapsulation surface, eliminating the need for separate solder joints and reducing signal propagation path length while maintaining reliable electrical connection.
Solution Approach 2:
The patent transitions from planar solder connections to three-dimensional wire bond structures that extend vertically through the encapsulation. The wire bonds create a dimensional advantage by routing connections through the depth of the package rather than relying solely on surface-mounted solder joints, thereby reducing signal propagation distance while maintaining connection reliability.
2Reliability
If traditional solder-based bonding methods are used, then electrical connection is achieved, but the assembly size increases
Solution Approach 1:
The patent extracts the bonding function from traditional solder-based methods and implements it through wire bonds that extend through the encapsulation. The wire bonds are directly connected to contact pads on the semiconductor die and extend beyond the encapsulation surface, eliminating the need for separate solder joints and reducing signal propagation path length while maintaining reliable electrical connection.
Solution Approach 2:
The wire bonds are nested within the encapsulation structure, with the encapsulation material surrounding and protecting the wire bonds. This nesting approach allows the connection structure to be integrated within the package volume rather than adding external bulk, achieving compact assembly size while maintaining reliable electrical connections.
3Loss of time
If wire bonds with uncovered extremities are used, then signal propagation time is reduced and compact design is enabled, but manufacturing complexity increases
Solution Approach 1:
The wire bonds are formed and positioned within the encapsulation before the final encapsulation curing process. The uncovered extremities are prepared in advance to receive external connections, allowing subsequent assembly steps to proceed efficiently. This preliminary positioning of wire bonds simplifies the overall manufacturing process despite the unconventional uncovered extremities.
Solution Approach 2:
The encapsulation material automatically surrounds and protects the wire bonds during the molding process, with the wire bonds self-aligning to their final positions. The uncovered extremities naturally extend beyond the encapsulation surface, eliminating the need for additional processing steps to create connection points. This self-service approach reduces manufacturing complexity despite the innovative wire bond configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the interposer's ability to connect semiconductor dies efficiently, allowing for compact designs and faster signal propagation, addressing the limitations of traditional bonding methods by providing a more effective electrical connection and reduced size.
Implementation Method 1
a plurality of wire bonds for electrical connection with first and second components. The wire bonds may have first and second opposite extremities at least not completely covered by the encapsulation at at least one of the first and second oppositely-facing surfaces, respectively
Implementation Method 2
Each of the wire bonds may have an edge surface between the first and second extremities that may be contacted by the encapsulation and that may be separated from the edge surfaces of adjacent wire bonds by the encapsulation
Data Source
AI summary
A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.