Bypass Diode Ribbon Assembly for Automated PV Module Integration
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Solution Overview
Problem
Existing bypass diode assemblies for photovoltaic modules are costly and difficult to integrate in a highly automated manner, requiring expensive materials and precise alignment, which hinders high-throughput fabrication and integration.
Innovation Solution
A bypass diode assembly comprising an electrically insulating tape with a conductive ribbon and a semiconductor component, where the ribbon is partially exposed at the front side for easy connection, allowing for automated fabrication and integration with photovoltaic cells.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If PCB strips with bypass diodes are used, then reliable electrical connection is achieved, but manufacturing cost increases due to packaging and mounting requirements
Solution Approach 1:
The bypass diode assembly is segmented into separate functional components: an insulating substrate, conductive ribbons for electrical connection, and the bypass diode component. This segmentation allows each component to be optimized independently and assembled through simple lamination, eliminating the need for complex PCB packaging and mounting while maintaining reliable electrical connections.
Solution Approach 2:
The insulating substrate and conductive ribbons are merged into a single integrated assembly through lamination, creating a pre-assembled bypass diode structure that can be directly mounted to photovoltaic cells. This merging eliminates separate packaging and mounting steps, reducing manufacturing cost while preserving electrical connection reliability.
2Reliability
If specifically dimensioned lead-diode assemblies are used, then bypass function is achieved, but handling difficulty increases and automation becomes problematic
Solution Approach 1:
The bypass diode assembly uses a flexible insulating substrate with thin conductive ribbons laminated to it, creating a thin, flexible structure that is easy to handle and position. This flexible film structure can be easily manipulated by automated equipment and aligned with photovoltaic cells, significantly improving handling ease compared to rigid lead-diode assemblies.
Solution Approach 2:
The bypass diode assembly is designed with flexible components that can adapt to slight position variations during assembly. The flexible insulating substrate and conductive ribbons can bend and conform to the mounting surface, enabling tolerance to alignment variations and facilitating automated assembly without requiring precise positioning.
3Manufacturing precision
If precise alignment is required for bypass diode integration, then electrical connection accuracy is improved, but manufacturing throughput decreases
Solution Approach 1:
The conductive ribbons are pre-attached to the insulating substrate in predetermined positions and configurations before the bypass diode component is mounted. This preliminary arrangement of electrical connections eliminates the need for complex alignment operations during final assembly, as the ribbons are already positioned to match the photovoltaic cell contacts, thereby maintaining precision while improving throughput.
Solution Approach 2:
The insulating substrate serves multiple functions: it provides electrical insulation, supports the conductive ribbons, and acts as a mounting base for the bypass diode component. This multi-functionality reduces the number of separate components and assembly steps required, eliminating the need for complex alignment operations while maintaining connection accuracy, thus improving manufacturing throughput.
Data Source
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AI summary
A bypass diode assembly and a method for fabricating the bypass diode assembly are provided, the bypass diode assembly comprising: an electrically insulating tape; an electrically conductive ribbon extending over the back side of the tape and locally exposed at the front side of the tape through an opening; a semiconductor component positioned in a hole through the tape, wherein the semiconductor component comprises a diode electrically connected between a first contact pad of the semiconductor component in electrical contact with the electrically conductive ribbon and a second contact pad of the semiconductor component; and an electrically conductive ribbon portion on the front side of the tape in electrical contact with the second contact pad of the semiconductor component. The electrically conductive ribbon portion is electrically isolated from the first electrically conductive ribbon by the electrically insulating tape. A photovoltaic module comprising at least one bypass diode assembly is provided.