Bypass Ring for IC Noise Isolation

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Solution Overview

Problem

High-density integrated circuits face challenges with crosstalk noise due to the proximity of high-frequency switching circuits and noise-sensitive circuits, particularly exacerbated by the seal ring structure which can propagate noise currents, affecting signal integrity.

Innovation Solution

A bypass ring is introduced around noise-sensitive circuits, with a bypass conductor electrically connected to the seal ring, matching impedance to reduce noise coupling by canceling magnetic fields, and optionally including ground connections to further minimize noise interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If circuits are placed closer together to increase circuit density, then productivity and functionality are improved, but noise coupling and crosstalk between circuits increase

Engineering Contradiction:
Improvecircuit densityVSAvoidnoise coupling
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

A bypass ring structure is introduced as an intermediary element between the seal ring and noise-sensitive circuits. The bypass ring provides an alternative current path that mediates the interaction between the seal ring's noise currents and the sensitive circuits, reducing coupling by up to 12 decibels while allowing high-density circuit placement

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If the seal ring is electrically grounded to reduce noise, then noise coupling is reduced, but device complexity and fabrication difficulty increase

Engineering Contradiction:
Improvenoise couplingVSAvoidfabrication complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The bypass ring is implemented using existing metal layers and conductive structures that are already part of the IC fabrication process. Rather than introducing a completely new grounding infrastructure, the solution uses readily available conductive materials and standard fabrication techniques to create the bypass path, reducing additional fabrication complexity

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Device complexity

If the seal ring is left ungrounded to simplify fabrication, then device complexity is reduced, but noise propagation along the seal ring increases

Engineering Contradiction:
Improvefabrication simplicityVSAvoidnoise propagation
Core Design Contradiction:
Device complexityVSObject-generated harmful factors

Solution Approach 1:

The bypass ring extracts the noise mitigation function from the seal ring structure itself. By separating the sealing function (performed by the seal ring) from the noise cancellation function (performed by the bypass ring), the solution allows the seal ring to remain simple and ungrounded while still achieving noise reduction through the dedicated bypass path

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The bypass ring effectively reduces noise coupling by up to 12 decibels, improving signal integrity and minimizing unwanted noise transfer between circuits, even when electrical grounding of the seal ring is unavailable.

Implementation Method 1

matching impedance to reduce noise coupling by canceling magnetic fields

Methodology Applied
Scientific EffectMagnetic field cancellation: Magnetic Field

Data Source

PatentUS9496231B1Bypass ring to improve noise isolation of coils and inductors
Publication Date: 2016.11.15 APPLE INC
  • US9496231B1 patent drawing
  • US9496231B1 patent drawing
  • US9496231B1 patent drawing

AI summary

An integrated circuit (IC) comprises a plurality of metal layers; a seal ring arranged around a perimeter of the IC and included in at least a portion of the plurality of metal layers; a first coil included in the IC; and a bypass conductor included in at least one metal layer of the plurality of metal layers and having at least a first end and a second end electrically coupled to the seal ring to form a bypass ring around the first coil.