Byproduct Trap Bypass Switching for Continuous Semiconductor Exhaust
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Solution Overview
Problem
The existing semiconductor manufacturing process is hindered by the need to stop operations and incur significant costs due to prolonged downtime for replacing and resetting the reaction by-product trapping apparatus, which causes pressure increases and contamination issues when clogged by accumulated by-products, necessitating a method to quickly replace the trapping apparatus without halting the process.
Innovation Solution
A process stop loss reduction system that allows for rapid replacement of the trapping apparatus by controlling flow paths for inert gas and exhaust gas, enabling continuous semiconductor production without stopping the process chamber operation, using a distributor, on-off valves, a bypass pipe, and a trapping system controller to manage gas flow and maintain optimal conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the trapping apparatus operates continuously to trap reaction by-products, then the trapping function is maintained, but pressure increases and space clogging occur due to accumulated by-products
Solution Approach 1:
The trapping apparatus is divided into multiple trapping chambers that can be operated independently. When one chamber becomes clogged, the system can switch to another chamber, allowing continuous trapping function while avoiding pressure buildup in any single chamber.
Solution Approach 2:
The system performs preliminary replacement of the trapping apparatus by preparing a standby trapping apparatus in advance. When the operating trapping apparatus shows pressure increase or clogging, the system automatically switches to the pre-prepared standby apparatus, preventing pressure buildup from affecting production.
2Stress or pressure
If the trapping apparatus is replaced frequently to maintain pressure levels, then pressure control is improved, but production downtime increases
Solution Approach 1:
A standby trapping apparatus is prepared in advance before the operating apparatus becomes fully clogged. This allows for hot-swapping or rapid replacement, maintaining pressure control while minimizing production downtime since the replacement apparatus is already ready.
Solution Approach 2:
The system ensures continuous trapping function by having a standby apparatus ready for immediate deployment. This eliminates idle time during replacement operations, as the standby apparatus can take over instantly, maintaining continuous pressure control without production interruption.
3Ease of repair
If the process chamber operation is stopped to replace the trapping apparatus, then replacement can be performed, but semiconductor production efficiency decreases
Solution Approach 1:
The standby trapping apparatus is prepared in advance with all necessary components and configurations. This preliminary preparation enables the operating apparatus to be replaced without stopping the process chamber, as the standby unit is ready for immediate deployment, thus maintaining production efficiency while facilitating easy replacement.
Solution Approach 2:
The standby trapping apparatus acts as an intermediary that takes over the trapping function temporarily or permanently, allowing the original apparatus to be replaced without interrupting the process chamber operation. This mediator approach enables maintenance activities to proceed independently of production activities.
4Productivity
If the trapping apparatus is not replaced timely, then production continuity is maintained, but contamination of the wafer occurs due to reverse flow of harmful gas
Solution Approach 1:
The system monitors pressure levels and prepares the standby trapping apparatus in advance before contamination risks develop. When pressure thresholds are approached, the system automatically switches to the standby apparatus, preventing harmful gas reverse flow and wafer contamination while maintaining production continuity.
Solution Approach 2:
The system continuously monitors pressure levels in the trapping apparatus and provides feedback to the control system. When pressure exceeds predetermined thresholds indicating potential contamination risk, the feedback triggers automatic switching to the standby apparatus, preventing wafer contamination while maintaining uninterrupted production.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables quick replacement of the trapping apparatus within about three hours, reducing semiconductor production costs and maintaining continuous operation by using inert gas to bypass clogged trapping apparatuses, thus minimizing downtime and improving productivity.
Implementation Method 1
a distributor configured to distribute exhaust gas or inert gas, which is supplied from the process chamber, to a flow path
Implementation Method 2
a first on-off valve configured to open or close the flow path for the exhaust gas or the inert gas distributed by the distributor
Implementation Method 3
a trapping apparatus configured to trap a reaction by-product in exhaust gas discharged from a process chamber during a semiconductor process
Implementation Method 4
a bypass pipe configured to receive the inert gas in response to the opening or closing of the second on-off valve and supply the inert gas to an exhaust pipe
Implementation Method 5
the heating gate valve configured to receive the exhaust gas or the inert gas from the trapping apparatus when the first on-off valve is opened and supply the exhaust gas or the inert gas to an exhaust pipe connected to a vacuum pump
Data Source
AI summary
Disclosed is a process stop loss reduction system, in which in case that pressure in a trapping apparatus and pressure in a process chamber are increased because of space clogging or the like caused by reaction by-products while the trapping apparatus for trapping of a reaction by-product contained in exhaust gas discharged from the process chamber operates over a long period of time during a semiconductor process, only the trapping apparatus, in which an exhaust gas supply flow path is blocked, may be quickly replaced while inert gas, instead of the exhaust gas, is received in an idle state and continuously supplied to the vacuum pump through a bypass pipe without stopping an operation of (shutting down) a semiconductor manufacturing process chamber facility, and then the trapping apparatus may be supplied with the exhaust gas again as the flow path is changed.