C-Shaped FPC Chip Package for TSV-Free Stacked Interconnects
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Solution Overview
Problem
Conventional chip packages with through silicon vias (TSVs) are labor-intensive and increase manufacturing costs due to complex internal circuit design requirements, necessitating avoidance of TSV positions.
Innovation Solution
A chip package unit utilizing a flexible printed circuit (FPC) board with a C-shaped section that clips the chip, featuring first, second, and third connecting pads to electrically connect die pads on the front and back surfaces, simplifying the connection process and reducing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through silicon via (TSV) is used for electrical connection, then electrical connectivity is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts the electrical connection function from the silicon substrate itself (TSV) and relocates it to a separate flexible printed circuit board. The FPC board is bent into a C-shape to clip around the chip, with connecting pads on the FPC providing electrical connections to die pads on the chip front and back surfaces, thereby eliminating the need for complex TSV formation processes.
Solution Approach 2:
The flexible printed circuit board serves as an intermediary component between the chip and the external circuit board. The FPC board with its C-shaped configuration and multiple connecting pads mediates the electrical connections, allowing die pads on both front and back surfaces of the chip to be connected to external circuits without requiring direct through-silicon vias.
2Reliability
If through silicon via (TSV) is used for electrical connection, then electrical connectivity is achieved, but manufacturing time and labor increase
Solution Approach 1:
The patent extracts the electrical connection function from the silicon substrate itself (TSV) and relocates it to a separate flexible printed circuit board. The FPC board is bent into a C-shape to clip around the chip, with connecting pads on the FPC providing electrical connections to die pads on the chip front and back surfaces, thereby eliminating the need for complex TSV formation processes.
Solution Approach 2:
The flexible printed circuit board is pre-formed with the C-shaped configuration and connecting pads before assembly. This preliminary preparation of the FPC board allows for quicker assembly compared to the multi-step TSV formation process, reducing overall manufacturing time.
3Reliability
If through silicon via (TSV) is used for electrical connection, then front and back surfaces can be connected, but internal circuit design becomes more difficult
Solution Approach 1:
The patent extracts the electrical connection function from the silicon substrate itself (TSV) and relocates it to a separate flexible printed circuit board. The FPC board is bent into a C-shape to clip around the chip, with connecting pads on the FPC providing electrical connections to die pads on the chip front and back surfaces, thereby eliminating the need for complex TSV formation processes.
Data Source
AI summary
A chip package unit, a method of manufacturing the same, and package structure formed by stacking the same are provided. At least one first connecting pad, at least one second connecting pad, and at least one third connecting pad of a flexible printed circuit (FPC) board in the chip package unit are electrically connected with one another by circuit of the FPC board. At least one die pad disposed on a front surface of a chip is electrically connected with the first connecting pad first and then electrically connected with the outside by the second connecting pad or the third connecting pad. Thereby the chip of the chip package unit can be electrically connected with the outside by the front surface or a back surface thereof. Therefore, not only production is reduced due to simplified production process and energy saved, volume of the package structure is also reduced.