C2W Package EMI Shielding Through Grounded Conductive Posts
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Solution Overview
Problem
Semiconductor devices in high-frequency applications face challenges with electromagnetic interference (EMI), radio frequency interference (RFI), and inter-device interference, which are not adequately addressed by existing shielding methods, particularly in chip-to-wafer (C2W) packages.
Innovation Solution
The implementation of electromagnetic shielding materials grounded through conductive posts, pins, wires, or vias within the C2W package structure, combined with conductive layers and encapsulants, to provide effective EMI and RFI protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If electromagnetic shielding materials are applied over the encapsulant in C2W packages, then EMI and RFI protection is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines multiple shielding functions into a single integrated shield structure that grounds EMI and RFI interference through conductive posts extending to the substrate. This merging approach consolidates what would otherwise require multiple separate shielding layers and grounding mechanisms, thereby reducing overall device complexity while maintaining comprehensive EMI/RFI protection.
Solution Approach 2:
The conductive posts serve as intermediary elements that bridge the shielding material and the ground plane, providing a dedicated path for interference current dissipation. This intermediary structure simplifies the grounding mechanism compared to direct connections, allowing the shielding material to be effectively grounded without complex wiring or additional components.
2Object-affected harmful factors
If shielding materials are conformally applied over the encapsulant, then EMI shielding effectiveness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The shielding structure is segmented into distinct functional components: the conformal shielding coating on the encapsulant, the conductive posts for grounding, and the ground plane on the substrate. This segmentation allows each component to be optimized and manufactured independently with appropriate precision levels, reducing the overall manufacturing precision burden compared to a single integrated shielding layer.
Solution Approach 2:
The encapsulant is formed and cured before the shielding material is applied, providing a stable, pre-defined surface for conformal coating. This preliminary action ensures that the shielding material adheres to a fixed geometry, reducing variability and precision requirements during the shielding application process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed shielding method significantly reduces EMI, RFI, and inter-device interference, ensuring reliable operation of high-frequency semiconductor devices by grounding the shielding materials through conductive paths to an external ground.
Implementation Method 1
grounding the shielding materials through conductive paths to an external ground
Implementation Method 2
An electromagnetic shielding material is commonly conformally applied over the encapsulant. The electromagnetic shielding material reduces or inhibits electromagnetic interference (EMI), radio frequency interference (RFI), and other inter-device interference
Data Source
AI summary
A semiconductor device has a substrate and an electrical component disposed over the substrate. A conductive post is formed over the substrate. An interposer can be disposed over the substrate and the electrical component disposed over the interposer and the conductive post formed over the interposer. An encapsulant is deposited over and around the substrate, electrical component, and conductive post. A shielding material is disposed over the substrate and encapsulant and grounded through the conductive post. The shielding material can be grounded through the interposer. A wire can be embedded in the encapsulant and coupled to the shielding material to ground the shielding material. A conductive via can be formed through the substrate and coupled to the shielding material to ground the shielding material. An interposer can be disposed over the encapsulant. A second shielding material can be disposed over the encapsulant and first shielding material.