Electronics Cabinet Cooling System with Fluidic Separation
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Solution Overview
Problem
Existing cooling systems for electronics cabinets with multiple cooling circuits suffer from high pressure drops due to sequential airflow over heat releasing sections, requiring larger, energy-consuming fans to manage heat transfer efficiently from the interior to the exterior.
Innovation Solution
A cooling system with a casing comprising three fluidically separated compartments, where the heat releasing sections of each cooling circuit are isolated from each other, allowing independent airflow management, reducing pressure drops and enabling smaller, less energy-consuming fans by preventing airflow mixing between compartments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat releasing sections of multiple cooling circuits are arranged sequentially in the same airflow path, then heat transfer is achieved, but pressure drops increase requiring larger energy-consuming fans
Solution Approach 1:
The patent divides the cooling system into multiple fluidically separated compartments, each handling a specific cooling circuit's heat releasing section. This segmentation prevents airflow mixing and reduces pressure drops, allowing smaller, less energy-consuming fans to be used while maintaining effective heat transfer from the interior to the exterior of the electronics cabinet.
Solution Approach 2:
The patent transitions from a sequential one-dimensional airflow arrangement to a multi-dimensional spatial distribution by placing heat releasing sections in different external side compartments. This dimensional change allows parallel heat transfer operations without airflow interference, reducing the energy required for fan operation.
2Temperature
If heat releasing sections are arranged sequentially in the same airflow path, then heat transfer occurs, but larger fans are required to manage the pressure drop
Solution Approach 1:
The cooling system is segmented into separate compartments for each cooling circuit's heat releasing section. This segmentation allows independent airflow management in each compartment, reducing the overall pressure drop and enabling the use of smaller, less complex fan devices while maintaining effective heat transfer.
Solution Approach 2:
The patent introduces fluidic separation as an intermediary mechanism between different cooling circuits. This separation prevents direct airflow interaction, reducing pressure drops and allowing smaller fans to suffice for each compartment, thereby reducing device complexity.
3Productivity
If airflow passes over multiple heat releasing sections sequentially, then heat is transferred, but pressure drops require larger fans
Solution Approach 1:
The patent segments the cooling system into multiple independent compartments, each handling a specific cooling circuit. This segmentation maintains effective cooling performance by ensuring proper heat transfer in each compartment while reducing the energy consumption of fans through lower pressure drops in the separated airflow paths.
Solution Approach 2:
By distributing heat releasing sections across different spatial compartments rather than arranging them sequentially in one airflow path, the patent achieves effective cooling performance through parallel heat transfer operations while reducing fan energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat transfer efficiency and reduces energy consumption by allowing each cooling circuit to operate effectively without interference, improving overall cooling performance and fan efficiency.
Implementation Method 1
a first cooling circuit (12) comprising a heat absorbing section (16)
Implementation Method 2
a first cooling circuit (12) comprising a heat releasing section (14)
Implementation Method 3
the three compartments (29, 30, 31) are fluidically separated from each other so that respective airflows in the cabinet side compartment (29), the first external side compartment (30) and the second external side compartment (31) do not mix
Data Source
Figure 1
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Figure 3
AI summary
A cooling system (100), in particular for electronics cabinets (10), comprising a casing (11), wherein the cooling system (100) comprises a first cooling circuit (12) and a second cooling circuit (13), the first cooling circuit (12) comprising a heat releasing section (14) and the second cooling circuit (13) comprising a heat releasing section (15), is provided, wherein the casing (11) comprises at least three compartments (29, 30, 31) including a cabinet side compartment (29), a first external side compartment (30) and a second external side compartment (31), wherein the three compartments (29, 30, 31) are fluidically separated from each other so that respective airflows (39, 41, 42) in the cabinet side compartment (29), the first external side compartment (30) and the second external side compartment (31) do not mix, wherein the heat releasing section (14) of the first cooling circuit (12) is arranged in the first external side compartment (30) and wherein the heat releasing section (15) of the second cooling circuit (13) is arranged in the second external side compartment (31).