Modular Cabinet Thermosiphon Cooling for High Heat Flux Electronics
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Solution Overview
Problem
Existing cooling systems for electric and electronic components in cabinets face challenges in efficiently managing high heat flux and power density, particularly in modular power converters, where air cooling methods often require significant space and may not adequately address the thermal loads generated by components like IGBTs and capacitors.
Innovation Solution
The implementation of a thermosiphon cooling system within the cabinet, where cooling air is directed through modules with evaporators and condensers arranged to maximize airflow and heat transfer efficiency, allowing for parallel flow of cooling air through multiple modules and utilizing a tilted evaporator configuration to minimize pressure drop and enhance airflow across the condenser.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling systems with fans and fin arrays are used to cool electric and electronic components in a cabinet, then the thermal load can be reduced by dumping heat to a distant location, but the system requires significant space and may not adequately address high heat flux and power density
Solution Approach 1:
The invention extracts the heat directly at the component level using integrated heat sinks and heat pipes attached to individual high-power components (IGBTs, diodes, capacitors), rather than relying on distant heat dumping. This removes the thermal problem at its source within compact spaces, eliminating the need for large external cooling infrastructure while effectively managing high heat flux and power density
Solution Approach 2:
The invention introduces heat pipes as intermediary thermal management devices between the heat-generating components and the cooling air flow. These heat pipes act as thermal mediators that efficiently conduct and transfer heat from compact component-mounted heat sinks to the surrounding cooling air, enabling effective heat removal from high-power-density areas without requiring large cooling system volumes
2Productivity
If modular power converters are used with multiple identical units for flexible configuration and servicing, then production and maintenance become more efficient, but managing thermal loads across multiple modules becomes more complex
Solution Approach 1:
The invention segments the thermal management system into identical, standardized modules, each with its own integrated cooling components (heat sinks, heat pipes, airflow channels). This modular segmentation allows each power converter unit to be independently cooled and maintained, simplifying thermal management across multiple modules while preserving the productivity benefits of modular construction and servicing
Solution Approach 2:
The invention creates universal, standardized cooling modules that can be applied to identical power converter units. Each module uses the same heat sink designs, heat pipe configurations, and airflow patterns, making the thermal management system universally applicable across all modular units. This standardization reduces thermal management complexity while maintaining the flexibility and efficiency of modular production and servicing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively manages high heat loads, reduces component temperatures, and allows for compact and efficient cooling of IGBT modules and capacitors, improving the overall thermal management and compactness of the system while maintaining low pressure drop and energy efficiency.
Implementation Method 1
an evaporator for receiving a first heat load generated by at least one electric and/or electronic component of each module
Implementation Method 2
a condenser for transferring a majority of the first heat load to the stream of cooling air
Data Source
AI summary
The present disclosure relates to the cooling of electric and/or electronic components, in particular to an electric and/or electronic system with a cabinet, which includes a cabinet housing including a first aperture for receiving a stream of cooling air. The cabinet housing includes a second aperture for releasing the cooling air thereafter in an operating state of the cabinet. At least two modules, which each include a guiding structure with an inlet and an outlet, are provided in the cabinet. The at least two modules are arranged in the cabinet housing such that a branch of the major portion of cooling air flowing through the first aperture of the cabinet housing is enabled to flow into each module via the inlet guided by the guiding structure through the dedicated module to the outlet and thereafter through the second aperture out of the cabinet housing.