Cable Assembly Structure for High-Speed PCB Signal Transmission
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Solution Overview
Problem
Conventional signal transmission structures within communications systems face limitations in high-speed signal transmission rates due to high material costs and significant signal loss within the circuit board, necessitating a new architecture to support increasing data requirements.
Innovation Solution
A signal transmission structure utilizing a cable assembly with conductive holes in the circuit board to connect chips directly to cables, reducing the need for internal wiring and allowing for higher signal transmission rates while lowering material costs and improving product performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If wires are disposed inside the circuit board to connect chip and connector, then signal transmission can be achieved, but signal loss is large and transmission rate is limited
Solution Approach 1:
The patent extracts the wiring function from the circuit board interior by introducing a cable assembly that extends outward from the circuit board surface. The cable assembly includes conductive holes through the circuit board that connect to external cables, thereby removing the need for complex internal wiring and reducing signal loss within the board material.
Solution Approach 2:
The patent introduces a cable assembly as an intermediary component between the chip and external connectors. This cable assembly with conductive holes serves as a mediator that provides a lower-loss transmission path compared to traditional internal wiring, thereby improving signal transmission rate while maintaining electrical connection.
2Reliability
If conventional wiring methods are used inside the circuit board, then connection between chip and connector is achieved, but product costs are relatively high
Solution Approach 1:
The patent segments the connection system into distinct components: the circuit board with conductive holes, the cable assembly, and external connectors. This segmentation allows each component to be optimized independently and assembled modularly, reducing manufacturing complexity and cost while maintaining connection reliability.
Solution Approach 2:
Instead of routing wires through the interior of the circuit board, the patent inverts the approach by bringing conductive paths to the surface through conductive holes and connecting to external cables. This inversion simplifies the internal circuit board structure and reduces manufacturing requirements, thereby lowering costs while maintaining reliable connections.
3Productivity
If high-level PCB board material is used to reduce signal loss, then signal transmission rate can be improved, but material costs increase significantly
Solution Approach 1:
The patent extracts the high-performance transmission function from the PCB board material by introducing a separate cable assembly with conductive holes. This allows the use of lower-cost PCB materials while achieving high signal transmission rates through the cable assembly, thereby reducing material costs without sacrificing performance.
Data Source
AI summary
A signal transmission structure includes a circuit board, a chip, and a cable assembly. The chip is assembled on one side of the circuit board, and the cable assembly is assembled on the other side of the circuit board. The cable assembly includes a cable, and the circuit board includes a plurality of conductive holes. The chip is electrically connected to the cable of the cable assembly using the conductive hole to transmit a signal of the chip using the cable.