Double-Ended Cable Bonding for Fine-Pitch Multi-Tier PCB Alignment
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Solution Overview
Problem
Current systems lack the capability to precisely bond cables to host substrates with finer pitches, particularly in assembling cables onto host electronics with pitches narrower than 300 μm, due to limitations in alignment accuracy and the design of existing die bonder systems.
Innovation Solution
A method and system utilizing a die bonder with a top bonder arm and optical system for precise alignment and bonding of double-ended cables to multi-tier substrates, achieving micron-level alignment accuracy by imaging alignment markers and adjusting the position of cable ends relative to the substrate, allowing for bonding with pitches as fine as 1 μm or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional die bonder systems are used for bonding cables to substrates, then the bonding process can be completed, but the alignment accuracy is insufficient for pitches narrower than 300 μm
Solution Approach 1:
The system divides the bonding task into multiple independent bonding heads (first bonding head and second bonding head), each capable of independently bonding cable ends to substrates. This segmentation allows each head to focus on specific bonding locations, improving alignment accuracy for fine pitches while maintaining manageable system complexity through modular architecture
Solution Approach 2:
The patent introduces a carrier as an intermediary component that holds multiple cable ends in a fixed geometric arrangement. This carrier serves as a reference frame that simplifies the bonding process by pre-establishing positions, allowing the bonding heads to achieve high alignment accuracy without requiring complex real-time positioning systems
2Manufacturing precision
If existing bonding methods are used, then the process is simpler, but the pitch capability is limited to 300 μm or larger
Solution Approach 1:
The patent replaces conventional mechanical positioning systems with an optical alignment system that uses vision guidance. Optical sensors and imaging systems capture positions of alignment markers on substrates and cable ends, enabling sub-micron alignment accuracy for pitches below 300 μm without requiring mechanically complex precision stages
Solution Approach 2:
The system performs preliminary alignment by capturing images of alignment markers before the actual bonding operation. This preliminary imaging and position calculation allows the system to pre-determine bonding head positions, ensuring high pitch capability while simplifying the real-time bonding process
Data Source
AI summary
A method of bonding a double-ended cable to a multi-tier substrate (such as a multi-tier printed circuit board) includes picking up the double-ended cable, and imaging alignment markers on a first head of the double-ended cable, a second substrate of the multi-tier substrate, a second head of the double-ended cable, and a first substrate of the multi-tier substrate. The method also includes aligning the alignment marker on the first head of the cable to the alignment marker on the second substrate of the multi-tier substrate, coupling the first head of the cable to the second substrate, and releasing the first head of the cable. The method further includes aligning the alignment marker on the second head of the cable to the alignment marker on the first substrate of the multi-tier substrate, coupling the second head of the cable to the first substrate, and releasing the second head of the cable.