Cable Connector Module With Interposer Contacts for Dense High-Speed I/O
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Solution Overview
Problem
Conventional communication systems face challenges in achieving higher density and performance due to long electrical paths on circuit boards, cable spacing limitations, and ineffective grounding structures, particularly at higher frequencies.
Innovation Solution
An electronic assembly design featuring a socket assembly with compressible interposer contacts and a cable connector module held by a cage, utilizing a spring clip to secure the module and improve electrical connections, along with a cable holder to enhance cable arrangement and grounding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If cable assemblies are terminated to a circuit card with conventional techniques, then the system can transmit electrical signals, but the spacing between rows of circuit cards must be ample to allow routing of cables, which increases the overall size of the electronic assembly
Solution Approach 1:
The patent transitions cable routing from a planar two-dimensional path on the circuit card surface to a three-dimensional path through vertical vias and stacked contact pads. This allows cables to be routed through the thickness of the circuit card rather than along its surface, dramatically increasing cable density without increasing the card's footprint area.
Solution Approach 2:
The patent implements nested contact pads where multiple contact pads are stacked vertically one above another within the same horizontal footprint area. This nesting arrangement allows multiple cable connections to occupy the same planar space by utilizing the vertical dimension, thereby increasing cable density without expanding the overall assembly size.
2Area of stationary object
If contact pads are spaced closer together to increase density, then the overall size of the electronic assembly is reduced, but conventional cable termination techniques cannot route cables adequately between rows
Solution Approach 1:
The patent resolves the cable routing difficulty by moving the routing path into the vertical dimension through vias that penetrate the circuit card. This allows cables to bypass the need for horizontal spacing between contact pad rows, enabling dense packing while maintaining manufacturable cable termination through vertical via access.
Solution Approach 2:
The patent segments the cable termination process into distinct vertical stages: cable entry at the top surface, routing through intermediate vias, connection to stacked contact pads, and signal transmission through the card. This segmentation allows each stage to be optimized independently, making dense cable termination manufacturable despite reduced spacing.
3Ease of operation
If long electrical paths are used on the circuit board to route signals, then the system can connect components, but electrical performance is reduced due to signal loss and increased path length
Solution Approach 1:
The patent extracts the signal transmission function from the traditional long trace path on the circuit board surface and relocates it to a direct vertical path through the card via vias and stacked contact pads. This extraction creates a much shorter electrical path that maintains connectivity while minimizing signal loss and improving electrical performance.
4Reliability
If conventional grounding structures are used at the interface between cables and circuit card, then the system can provide basic grounding, but the grounding is ineffective at higher frequencies and data speeds
Solution Approach 1:
The patent improves grounding effectiveness by transitioning from a two-dimensional planar ground structure to a three-dimensional vertically stacked ground configuration. Multiple ground contact pads are stacked vertically and connected through vias, creating a low-inductance ground path that effectively handles high-frequency signals and fast data rates.
Solution Approach 2:
The patent employs a composite grounding structure combining multiple conductive elements (ground contact pads, via fills, and ground planes) arranged in a vertical stack. This composite configuration creates a multi-path ground return that reduces inductance and improves high-frequency performance compared to conventional single-layer grounding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design increases cable density and improves electrical performance by reducing signal loss and cross-talk, allowing for higher data speeds and efficient heat dissipation.
Implementation Method 1
The spring clip presses the cable connector module into the socket connector to mate the mating contact pads with the upper contact portions of the interposer contacts
Implementation Method 2
The upper contact portion is compressible. The lower contact portion is compressible. The lower contact portion is terminated to a board contact of the circuit board.
Data Source
AI summary
An electronic assembly includes a socket assembly including a cage mounted to a circuit board and a socket connector received in a cavity of the cage. The socket connector includes a substrate holding interposer contacts with compressible upper and lower contact portions. The electronic assembly includes a cable connector module received in the cavity of the cage and coupled to the socket connector. The cable connector module includes a housing coupled to the cage, a circuit card received in the cavity of the housing, and cable assemblies coupled to the circuit card. The circuit card is coupled to the socket connector.