Cable Connector Socket Nested in PCB Through Hole for EMI Shielding
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Solution Overview
Problem
The protrusion of female connectors on the substrate surface increases the height of cable connectors, affecting the disposition of other components and compromising electromagnetic interference (EMI) shielding in electronic devices.
Innovation Solution
The implementation of a through hole in the substrate to house the socket part of the cable connector, along with a shielding member to cover the head part, reduces the overall height and enhances EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the female connector is disposed on the surface of the substrate to be coupled to the male connector, then the cable connector can be electrically connected to the substrate, but the disposition height increases and affects the disposition of other components
Solution Approach 1:
The socket part is disposed inside a through hole formed in the substrate, nesting the connector within the substrate structure. This allows the cable connector to be electrically connected to the substrate while minimizing the disposition height, as the connector is housed within the substrate thickness rather than protruding from it.
2Ease of operation
If the female connector is disposed on the surface of the substrate, then the cable connector can be coupled to the male connector, but the overall thickness of the electronic device increases
Solution Approach 1:
The socket part is nested within the through hole of the substrate, allowing the cable connector to be coupled to the male connector while keeping the overall thickness minimal. The connector structure is contained within the substrate volume rather than adding to the external dimensions.
3Ease of operation
If the disposition height of the cable connector increases, then the cable connector can be coupled to the male connector, but the gap with the shielding material increases and EMI shielding becomes incomplete
Solution Approach 1:
The socket part is disposed inside the through hole, nesting it close to the shielding material that lines the through hole. This minimizes the gap between the cable connector and shielding material, ensuring complete EMI shielding while still allowing the connector to be coupled to the male connector.
Solution Approach 2:
The through hole structure, which could be seen as creating space for the connector, is instead utilized to bring the connector closer to the shielding material. The shielding material is disposed within the through hole to coincide with the socket part, converting the potential harm of increased gap into the benefit of reduced gap and improved EMI shielding.
Data Source
AI summary
An electronic device is disclosed, including: a plurality of electrical components, a substrate including a circuit electrically connected to the electrical component, wherein a through hole is formed penetrating the substrate in a thickness direction from an upper surface of the substrate, a cable, a head part coupled to an end portion of the cable, and a socket part including a contact pin of which at least a portion thereof is disposed inside the through hole and extends laterally with respect to a lower surface of the substrate, so as to be electrically connected to the substrate, and coupled to the head part in a direction of the upper surface of the substrate.