Cable End Connector Heat Diffusion for High-Speed Transmission
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Solution Overview
Problem
Conventional cooling methods for high-speed data transmission cables, such as AOC and AEC, face inefficiencies due to insufficient thermal conductivity in the metal case, limiting heat dissipation and impacting transmission speed.
Innovation Solution
A cable end connector design featuring a thermal diffusing unit with a larger heat conducting area, connected to both the heating source and the case, and a first heat sink with enhanced heat transfer coefficients, allowing for improved heat dissipation by expanding the heat conducting area and facilitating heat transfer to the air outside.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal case with sufficient rigidity is used to withstand external forces, then the mechanical strength is improved, but the thermal conductivity becomes insufficient, leading to poor heat dissipation
Solution Approach 1:
The patent introduces a thermal diffusing unit as an intermediary component between the heating source and the metal case. This thermal diffusing unit has high thermal conductivity and serves as a mediator to transfer heat from the heating source to the case, overcoming the insufficient thermal conductivity of the metal case while maintaining its mechanical strength.
Solution Approach 2:
The thermal diffusing unit extends in the thickness direction of the case, creating a three-dimensional heat conduction path. This dimensional extension allows heat to be conducted from the heating source through the thermal diffusing unit to a larger area of the case, effectively increasing the heat dissipation surface area without compromising the case's mechanical integrity.
2Loss of energy
If thermal paste or thermal conductive sheet is applied to the optical module or IC to transfer heat to the case, then the heat transfer path is established, but the heat can only be transmitted to a limited area of the case, resulting in low heat dissipation efficiency
Solution Approach 1:
The thermal diffusing unit extends in the thickness direction of the case, creating a three-dimensional heat conduction path. This dimensional extension allows heat to be conducted from the heating source through the thermal diffusing unit to a larger area of the case, effectively increasing the heat dissipation surface area without compromising the case's mechanical integrity.
Solution Approach 2:
The thermal diffusing unit is divided into a first portion and a second portion, with the first portion having a larger area than the second portion. This segmentation allows the thermal diffusing unit to progressively distribute heat from a concentrated source to a wider area, improving heat dissipation efficiency while maintaining structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly enhances heat dissipation efficiency by increasing the heat conducting area and improving heat transfer, addressing the limitations of conventional methods and maintaining performance under standard specifications.
Implementation Method 1
The thermal diffusing unit is thermally connected to the heating source and the upper shell... an area of the thermal diffusing unit thermally connected to the upper shell is bigger than an area of the thermal diffusing unit thermally connected to the heating source
Implementation Method 2
the heat generated by the heating source can be transmitted sequentially through the thermal diffusing unit and the first heat sink to the air outside the case
Data Source
AI summary
A connector has a case, a circuit board, a thermal diffusing unit, and a first heat sink. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. A heat transfer coefficient of the thermal diffusing unit is larger than a heat transfer coefficient of the case. The first heat sink abuts the thermal diffusing unit and is exposed from the case. A heat transfer coefficient of the first heat sink is larger than the heat transfer coefficient of the case. By the first heat sink abutting the thermal diffusing unit and exposed from the case, and the heat transfer coefficients of both the thermal diffusing unit and the first heat sink being larger than that of the case, the heat dissipation efficiency is improved.