Cable Connector With Integrated Memory Module

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Solution Overview

Problem

Conventional electrical connectors and cables do not incorporate memory modules, such as EEPROMs, either in-line with signal and power cables or insertable into their housings, limiting their functionality and flexibility.

Innovation Solution

The integration of an EEPROM module into cable connector systems, where it can be mounted to a substrate spaced away from the connector and connected to signal cable conductors, allowing for in-line placement or insertion into the connector housing without requiring a substrate or circuit board within the connector.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a memory module is integrated into a cable connector system, then functionality and flexibility are enhanced, but device complexity increases

Engineering Contradiction:
ImprovefunctionalityVSAvoiddevice complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The memory module is nested within the cable connector housing, with the substrate and memory module fitting inside the existing connector structure. This allows the memory functionality to be integrated without requiring a completely new device design, thus enhancing functionality while controlling complexity growth.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The cable connector system is segmented into distinct functional modules: the connector housing, the substrate, the memory module, and the cable assembly. This segmentation allows each component to be designed and manufactured independently, then assembled together, which enhances adaptability while managing overall device complexity.

Inventive Principle:
Principle #1Segmentation

2Ease of operation

If a substrate is used to mount the memory module, then the memory module can be connected to signal conductors, but the connector structure becomes more complex

Engineering Contradiction:
Improveease of implementationVSAvoidconnector structure
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The substrate serves multiple functions: it provides mechanical support for the memory module, establishes electrical connections between the memory module and signal conductors, and structurally connects the memory assembly to the cable. This multi-functionality reduces the need for additional components, making implementation easier while controlling structural complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of manufacture

If the memory module is spaced away from the connector, then it can be easily implemented and maintained, but connection reliability may be affected

Engineering Contradiction:
Improveease of implementationVSAvoidconnection reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The substrate provides localized structural support and electrical connection pathways between the spaced memory module and the connector. This localized support ensures reliable connections are maintained at critical points while allowing the memory module itself to be positioned optimally for manufacturing and maintenance access.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20230070890A1Cable connector system
Publication Date: 2023.03.09 SAMTEC INC
  • US20230070890A1 patent drawing
  • US20230070890A1 patent drawing
  • US20230070890A1 patent drawing

AI summary

A cable assembly includes a first connector that includes a first connector housing, at least two connector conductors and at least two signal conductors included in the first connector housing, at least two connector cable conductors that are each physically connected to a respective one of the at least two connector conductors, at least two signal cable conductors each physically connected to a respective one of the at least two signal conductors, a substrate, and a memory module mounted to the substrate. The substrate and the memory module are either spaced away from the first connector or connected to a conductor in the first connector housing through an opening in the first corrector housing.