Cable Connector Orthogonal Nesting for High Throughput
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current connector systems for data throughput in a 1 RU panel face challenges in achieving high data rates while maintaining low insertion loss and crosstalk, especially at frequencies up to 28 GHz and 56G NRZ/112G PAM4 standards, with existing solutions limited to around 14.4 Tb/sec throughput.
Innovation Solution
The development of cable connector systems that allow orthogonal connection to board connectors with compression spring ground blades, enabling stacked or nested configurations, which reduce footprint and stack height, and support up to 32 differential signal pairs with minimal insertion loss and crosstalk, achieving throughputs of at least 37.5 Tb/sec on standard die packages and 50 Tb/sec on larger packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional connector configurations are used, then the footprint and stack height are larger, but the data throughput is limited to around 14.4 Tb/sec
Solution Approach 1:
The patent implements nested connector configurations where cable connectors are positioned within or alongside board connectors, allowing multiple connectors to occupy overlapping spatial footprints. This nesting approach enables higher density interconnect configurations that achieve 37.5 Tb/sec and 50 Tb/sec throughput while maintaining compact form factors suitable for 1 RU panel deployments.
Solution Approach 2:
The patent transitions from planar connector arrangements to three-dimensional stacked configurations, utilizing vertical stacking of connector layers to increase port density. By arranging connectors in multiple layers along the vertical dimension, the system achieves higher throughput capacities without proportionally increasing the horizontal footprint, enabling 37.5 Tb/sec and 50 Tb/sec performance in compact 1 RU enclosures.
2Productivity
If higher data rates are achieved, then throughput increases to 37.5 Tb/sec and 50 Tb/sec, but insertion loss and crosstalk become more significant
Solution Approach 1:
The patent introduces compression spring ground blades as intermediary shielding elements between signal conductors. These ground blades act as electromagnetic shields that intercept and redirect interfering fields, reducing crosstalk and insertion loss. The spring mechanism ensures consistent electrical contact and shielding effectiveness across the high-frequency range required for 37.5 Tb/sec and 50 Tb/sec throughput, maintaining signal integrity at elevated data rates.
3Productivity
If more signal pairs are integrated, then throughput increases to 37.5 Tb/sec and 50 Tb/sec, but frequency domain crosstalk increases
Solution Approach 1:
The patent employs compression spring ground blades as intermediary shielding structures positioned between adjacent differential signal pairs. These ground blades create electromagnetic barriers that isolate neighboring signal paths, preventing capacitive and inductive coupling. The spring-loaded design maintains consistent shielding pressure and electrical contact, effectively suppressing frequency domain crosstalk while enabling high-density signal pair integration for 37.5 Tb/sec and 50 Tb/sec throughput.
Solution Approach 2:
The patent applies localized shielding using compression spring ground blades at specific high-crosstalk locations between signal pairs. Rather than uniform shielding throughout the connector, the ground blades are strategically positioned where crosstalk is most severe, providing targeted electromagnetic isolation. This localized approach effectively reduces frequency domain crosstalk in critical areas while maintaining high signal pair density for 37.5 Tb/sec and 50 Tb/sec performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables significantly higher data throughput of at least 37.5 Tb/sec on standard die packages and 50 Tb/sec on larger packages with improved frequency domain crosstalk performance, exceeding the limitations of prior art by more than double, while maintaining low insertion loss and return loss within specified frequency ranges.
Implementation Method 1
board connectors with compression spring ground blades that connect electrically with connector shields of a respective cable connector
Data Source
AI summary
A cable connector includes a cable including a center conductor and a housing supporting a portion of the center conductor. An imaginary line divides a cross-section of the center conductor into two semicircles, and when the cable connector is mated with a mating connector, only one of the two semicircles is directly connected with a corresponding contact of the mating connector.