High-Density Cable Connector With Pressure-Mount PCB Contacts

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Solution Overview

Problem

Existing high-speed connectors for electronic systems face challenges in efficiently routing high-frequency signals with high signal integrity over long distances without requiring extensive soldering, which can lead to manufacturing errors and difficulty in maintenance.

Innovation Solution

A high-speed, high-density cable connector with a housing and terminals that form a pressure mount connection to a printed circuit board, featuring angled contact portions and a shield mechanism for consistent shielding, allowing for dense cable arrangement and improved signal transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional soldering connections are used to join connectors to printed circuit boards, then reliable electrical connection is achieved, but manufacturing complexity increases and manufacturing errors occur more frequently

Engineering Contradiction:
Improveconnection reliabilityVSAvoidmanufacturing ease
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces the traditional soldering mechanical system with a pressure-mounted electrical connection system. The connector features a housing with a pressing portion that applies mechanical pressure to clamp the electrical connection portion onto the circuit board contact portions, eliminating the need for thermal soldering processes while maintaining reliable electrical connections.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent extracts the soldering process entirely from the connection system. By designing a dedicated pressing portion within the housing that independently applies clamping force to the electrical connection portion, the system separates the mechanical attachment function from the electrical connection function, allowing pressure-mounted connections to replace soldering without requiring soldering equipment or processes.

Inventive Principle:
Principle #2Taking out (Extraction)

2Quantity of substance

If cable density is increased to route more signals, then signal routing capacity improves, but signal integrity deteriorates due to interference

Engineering Contradiction:
Improvesignal routing capacityVSAvoidsignal integrity
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent applies local quality by providing individual shielding for each electrical connection portion or group of connection portions. The housing includes shielding structures positioned locally around specific signal paths, allowing high-density cable arrangement while maintaining signal integrity through localized electromagnetic interference protection for each signal channel.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent introduces shielding structures as intermediary elements between adjacent electrical connection portions. These shielding portions act as mediators that block electromagnetic interference between closely spaced signals, enabling high-density routing while preserving signal quality by isolating each signal path from its neighbors.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Volume of moving object

If connector size is reduced to occupy minimal space, then space utilization improves, but manufacturing precision requirements increase

Engineering Contradiction:
Improveconnector volumeVSAvoidmanufacturing precision
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent segments the connector into distinct functional portions: a housing, an electrical connection portion, and a pressing portion. This segmentation allows each component to be manufactured and assembled separately with standardized tolerances, reducing the cumulative precision requirements that would arise from manufacturing a single integrated miniaturized component while still achieving compact overall dimensions.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS12555935B2High speed, high density cable connector
Publication Date: 2026.02.17 AMPHENOL COMML PROD (CHENGDU) CO LTD
  • US12555935B2 patent drawing
  • US12555935B2 patent drawing
  • US12555935B2 patent drawing

AI summary

A connector configured to connect densely disposed cables to a board. The connector may include two or more rows of terminals held by a housing such that the two or more rows of terminals are at a same height with respect to a board that the connector would be mounted to. Such a configuration enables the connector to fit into a space limited by, for example, another component mounted to the board. The terminals may include first contact portions configured to be mounted onto a surface of the board when pressure is applied to the terminals so as to avoid the use of materials that may cause undesired shorting such as soldering materials. The terminals may include second contact portions configured to receive the cables. The second contact portions of ground terminals of a same row may be connected by a strip configured to contact shields of cables attached to the row.