Cable Module Upper Cover With Direct Heat Block Cooling
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Solution Overview
Problem
Conventional heat dissipation methods for high-frequency high-speed transmission cable modules with 800G data rate are inadequate, leading to elevated temperatures that reduce IC chip efficiency, increase bit error rates, and decrease transmission speed.
Innovation Solution
A heat dissipation block is embedded in the cover body's through hole, allowing direct transfer of heat to heat dissipation fins without passing through the main body, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the conventional heat dissipation method is used (heat dissipation block transfers heat to heat dissipation fins indirectly through the cover body), then the structure is simple, but the heat dissipation efficiency is limited and cannot maintain appropriate temperature for 800G data rate modules
Solution Approach 1:
The heat dissipation block is extracted from the conventional indirect heat transfer path and repositioned to directly contact the heat dissipation fins. This extraction of the heat dissipation function from the cover body structure allows for direct thermal coupling between the control module and heat dissipation fins, eliminating the thermal resistance of the cover body and significantly improving heat dissipation efficiency for 800G data rate modules
Solution Approach 2:
The patent introduces a thermal interface material as an intermediary between the heat dissipation block and the heat dissipation fins. This intermediary ensures optimal thermal contact and heat transfer while accommodating any surface irregularities, thereby maximizing the heat dissipation efficiency without requiring direct metal-to-metal contact
2Speed
If the data rate is increased to 800G, then the transmission speed is improved, but the heat generated by the control module increases and conventional heat dissipation methods become insufficient
Solution Approach 1:
The patent changes the thermal parameters of the heat dissipation system by directly coupling the heat dissipation block with the heat dissipation fins, thereby increasing the heat transfer coefficient. This parameter change enables the system to handle the higher heat generation from 800G data rate operations while maintaining appropriate control module temperature
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved heat dissipation maintains appropriate temperatures for the control module and cable ends, preventing IC chip efficiency reduction and bit error rate increases, even at high data rates.
Implementation Method 1
the heat dissipation block to directly transfer heat to the heat dissipation fins without indirectly passing through the main body
Data Source
AI summary
An upper cover of a cover body of a high-frequency high-speed transmission cable module is provided, including a main body and a heat dissipation block. Two end portions in the length direction of the main body are respectively defined as a first end portion and a second end portion, and the first end portion is provided with a through hole. The heat dissipation block is embedded in the through hole and exposed on the top surface of the first end portion. As such, the present invention can use the heat dissipation block to directly transfer heat to the heat dissipation fins without indirectly passing through the main body, so the heat dissipation efficiency is greatly improved.