Cable Connector Module With Through-Card Vias for Dense Routing
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Solution Overview
Problem
Conventional communication systems face challenges in achieving high electrical performance due to long electrical paths on circuit boards, signal losses between connector interfaces, and ineffective grounding structures, particularly at higher frequencies, while also struggling with cable density and spacing limitations.
Innovation Solution
A cable connector module with signal and ground vias through the circuit card, coupled with cable assemblies and ground clips that provide angled cable exits, reducing signal losses and improving grounding efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If cables are routed along the circuit card with conventional termination techniques, then cable routing is achieved, but ample spacing is needed between rows of circuit cards increasing the overall size
Solution Approach 1:
The patent applies dimensionality change by transitioning cable routing from a planar path along the circuit card surface to a three-dimensional path through vertical vias and angled exits. The cable assembly includes vias that extend through the circuit card at angles (e.g., 45 degrees), allowing cables to exit in different spatial dimensions rather than remaining confined to the card plane. This enables tighter spacing between circuit cards while maintaining proper cable routing and grounding.
Solution Approach 2:
The invention implements nesting by integrating the grounding structure within the cable assembly itself rather than as a separate external component. The ground clips are positioned to surround and nest with the signal conductors, with grounding tabs making contact with both the circuit card ground pads and the cable shield. This nested arrangement reduces overall assembly size by eliminating the need for separate grounding structures while maintaining effective grounding.
2Quantity of substance
If contact pads are spaced closer together to increase density, then cable density increases, but routing of cables from the circuit card becomes difficult with conventional techniques
Solution Approach 1:
The patent resolves the routing difficulty at high density by using vertical and angled vias that extend through the circuit card. Instead of routing cables along the surface where spacing constraints apply, the cables pass through the thickness of the card via plated holes at various angles, then exit closer to the contact pads. This three-dimensional routing approach enables much higher cable density while maintaining manufacturability.
Solution Approach 2:
The invention introduces an intermediary structure - the angled via with ground clip assembly - that mediates between the densely spaced contact pads and the cable connections. The via acts as an intermediate connection point that allows signal and ground paths to be established without requiring large surface spacing, while the ground clip provides an intermediate grounding mechanism that connects to both the via and the cable shield.
3Reliability
If conventional grounding structures are used at the interface between cables and circuit card, then grounding is provided, but grounding becomes ineffective at higher frequencies
Solution Approach 1:
The grounding structure is segmented into multiple discrete grounding tabs on the ground clip, with each tab making contact with separate ground pads on the circuit card. This segmentation provides multiple parallel grounding paths at different locations, which improves high-frequency grounding effectiveness by reducing inductance and providing redundant paths. The segmented approach maintains reliability while keeping the overall structure relatively simple.
Solution Approach 2:
The grounding improves high-frequency performance by transitioning from a planar ground connection to a three-dimensional grounding architecture. The ground clips extend vertically and at angles to contact both the cable shield and multiple ground pads on the circuit card, creating a立体 grounding structure that reduces ground loop area and inductance, thereby improving effectiveness at higher frequencies.
Data Source
AI summary
A cable connector module includes a circuit card having signal contact pads on an upper surface and signal mating pads on a lower surface configured to be mated with interposer contacts of a socket connector. Signal vias extend directly through the circuit card electrically connecting the signal contact pads and the corresponding signal mating pads in the shortest path possible. The cable connector module includes cable assemblies terminated to the upper surface having a cable and a ground structure coupled to an end of the cable.