Communication Cable Resin Connection Reinforcement
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Solution Overview
Problem
High-density arrangement of slots in communication devices leads to increased bending and tensile forces on communication cables, risking damage to connection portions between core cables and substrates, particularly at joint areas not reinforced by molding resin.
Innovation Solution
The communication cable features a resin portion that molds the connection between the cable and substrate, excluding the solder joints, to enhance structural integrity and prevent damage from excessive forces, with the resin portion extending to integrate the core cables and fix them to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If slots are arranged with high density to achieve downsizing and high functionality, then the number of slots increases, but bending and tensile forces on cables increase causing connection damage
Solution Approach 1:
The patent applies beforehand cushioning by introducing a resin portion that molds and protects the connection portion between the cable and substrate before any damage can occur. This resin cushioning layer is specifically designed to absorb and distribute bending and tensile forces, preventing direct transmission of stress to the vulnerable solder joints and connection points, thereby maintaining connection integrity even under high-density slot arrangements
Solution Approach 2:
The patent employs composite materials by combining the resin portion with the cable structure and substrate assembly. The resin material serves as a protective composite layer that integrates with the existing cable and substrate components, creating a unified structure where the resin's mechanical properties (flexibility, stress distribution) complement the electrical and structural functions of the cable and substrate, thereby enhancing overall connection reliability
2Stability of the object's composition
If molding resin is used to integrate core cables, then structural integrity improves, but connection portions at solder joints remain vulnerable to force damage
Solution Approach 1:
The patent applies local quality by specifically targeting the connection portion between the cable and substrate for reinforcement with the resin portion, while leaving other parts of the cable structure unchanged. This localized approach ensures that the resin's protective and stress-distributing properties are concentrated exactly where the solder joints and connection points are most vulnerable to bending and tensile forces, without unnecessarily modifying the rest of the cable assembly
Data Source
AI summary
In a communication cable having a multi-core cable with a plurality of core cables in which a pair of signal lines are covered with an insulator, in which the insulator is covered with a shield tape, and in which the shield tape is covered with a wrapping tape, and having a connector formed on an end portion of the multi-core cable, the communication cable further has a substrate to which each core cable is connected; a first joint portion at which the signal line and the substrate are solder-joined to each other; a second joint portion at which the shield tape and the substrate are solder-joined to each other; and a resin portion which molds a connection portion between the core cable and the substrate, and the connection portion excluding the first joint portion and the second joint portion is molded by the resin portion.