Cable Socket Connector Assembly High-Speed Signal Routing
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Solution Overview
Problem
Conventional socket connector assemblies face challenges in achieving high-speed electrical performance due to limited surface area on electronic packages and multiple electrical interfaces, which hinder signal and power output while occupying board space.
Innovation Solution
A cable socket connector assembly that includes a socket assembly with socket contacts and substrate conductors, where the socket contacts are spring-loaded to ensure electrical contact with package contacts, and a cable assembly directly connected to the socket assembly, bypassing the host circuit board for high-speed signal routing, thereby reducing the number of interfaces and enhancing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional socket connector assemblies are used with multiple electrical interfaces, then device compatibility is improved, but electrical performance deteriorates due to signal loss and increased path length
Solution Approach 1:
The patent extracts the high-speed signal transmission function from the conventional host circuit board path and creates a dedicated direct connection path through the socket connector. This separates the high-speed signal routing from general-purpose board routing, eliminating unnecessary interfaces and intermediate connection points that degrade signal quality.
Solution Approach 2:
The socket connector is segmented into distinct functional zones: a first set of contacts for electronic package connections, a second set for cable assembly connections, and an integrated substrate providing direct electrical pathways. This segmentation allows optimized signal paths for high-speed communications while maintaining compatibility with standard electronic packages.
2Reliability
If the number of conductors is increased to meet signal and power output requirements, then electrical performance is improved, but device size increases occupying board space
Solution Approach 1:
The patent transitions from planar board-mounted connector layouts to a three-dimensional socket connector structure that extends vertically from the circuit board. This allows multiple conductors to be packed in a compact footprint by utilizing the vertical dimension, increasing conductor density without proportionally increasing board space occupation.
Solution Approach 2:
The socket connector structure nests multiple functional elements within a compact form factor: the substrate, contact arrays, and internal signal pathways are integrated in a nested configuration that maximizes conductor density while minimizing the overall footprint on the host circuit board.
3Area of stationary object
If surface mount technology is used to increase component density, then board space is reduced, but electrical performance deteriorates due to limited surface area for conductors
Solution Approach 1:
The socket connector utilizes vertical stacking and three-dimensional contact arrangements to provide extensive conductor surface area within a compact board footprint. The substrate thickness and contact height dimensions provide additional conductor real estate beyond what is available on the board surface, enabling high conductor density without sacrificing electrical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances electrical performance by providing a higher density of connection points, shortening electrical paths, and improving signal transfer efficiency directly from the electronic package to the cable assembly, reducing the need for routing through the host circuit board and minimizing component costs.
Implementation Method 1
The socket contacts extend between terminating ends and mating ends with the terminating ends terminated to corresponding socket substrate conductors and the mating ends configured to be terminated to corresponding package contacts of an electronic package of the electronic system
Data Source
AI summary
A cable socket connector assembly for an electronic system includes a socket assembly having a socket substrate including socket substrate conductors. The socket assembly has socket contacts extending between terminating ends and mating ends with the terminating ends terminated to corresponding socket substrate conductors and the mating ends configured to be terminated to corresponding package contacts of an electronic package of the electronic system. The cable socket connector assembly includes a cable assembly terminated to the socket assembly having an array of cables each having a cable conductor terminated to a corresponding socket substrate conductor. The socket contacts and the corresponding socket substrate conductors define electrical paths between the cable conductors of the cables and the package conductors of the electronic package.