Cable Connection Substrate Heat Dissipation via Electrode Area
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Solution Overview
Problem
Endoscopes face challenges in efficiently dissipating heat generated by imaging elements, which can lead to thermal influences and affect the performance of the imaging apparatus.
Innovation Solution
A cable connection substrate configuration is implemented, comprising a first substrate connected to the imaging element and a second substrate connected to cables, with a greater sum of effective conductor areas on the cable connection electrodes compared to the third connection electrodes, enhancing heat dissipation while maintaining efficient electrical signal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat discharging member with high thermal conductivity is arranged to contact the imaging element, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat discharging function with the existing substrate structure by making the substrate itself serve as the heat discharging member. The substrate is designed with high thermal conductivity and direct contact with the imaging element, combining structural support and thermal management functions into a single component, thereby improving heat dissipation without increasing device complexity
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: it provides mechanical support for the imaging element, serves as an electrical connection pathway, and acts as a heat discharging member. This multi-functionality eliminates the need for separate heat dissipation components, resolving the contradiction between improved heat dissipation and increased device complexity
2Temperature
If the sum of effective conductor areas of cable connection electrodes is increased, then heat dissipation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent divides the heat dissipation function across multiple cable connection electrodes distributed on the substrate surface. By segmenting the total conductor area into several discrete electrodes rather than requiring one large precise electrode, the design achieves high total thermal conductivity while allowing for standard manufacturing tolerances on each individual electrode
Solution Approach 2:
The patent utilizes the two-dimensional surface of the substrate to distribute multiple cable connection electrodes across a larger area. This dimensional approach allows the sum of effective conductor areas to be increased without requiring any single electrode to have excessive precision, as the thermal load is distributed across multiple locations in the plane of the substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces thermal influence on the imaging element by directing heat away from the imaging element to the cable connection area, improving heat dissipation and maintaining signal integrity.
Implementation Method 1
A sum of effective conductor areas of the plurality of cable connection electrodes is greater than a sum of effective conductor areas of the third connection electrode
Implementation Method 2
an imaging element that includes a light receiver configured to perform photoelectric conversion on incident light to generate an electrical signal
Data Source
AI summary
A cable connection substrate includes: a first substrate that is provided with, on a front surface of the first substrate, a first connection electrode to be connected to a sensor electrode of an imaging element, and provided with a second connection electrode on a back surface side of the first substrate; and a second substrate that is provided with, on a front surface of the second substrate, a third connection electrode to be connected to the second connection electrode, and provided with, on a top surface side of the second substrate, the top surface being a side surface perpendicular to the front surface of the second substrate, a plurality of cable connection electrodes to be connected to a plurality of cables. A sum of effective conductor areas of the plurality of cable connection electrodes is greater than a sum of effective conductor areas of the third connection electrode.