Cable Tie Mount Nubs for Uniform Adhesive Bond-Line Control
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Solution Overview
Problem
Conventional cable tie mounts with adhesive bonding surfaces face challenges in achieving an optimum bond-line thickness without glass beads, leading to excess adhesive weight and increased curing time, which is problematic for aerospace and space-bound vehicles where weight and structural integrity are critical concerns.
Innovation Solution
A cable tie mount design featuring a top surface with a slanted central portion for guiding cables, a bottom surface with predefined nubs for symmetrical adhesive placement, and optional grooves for weight reduction, allowing for optimal adhesive thickness without glass beads and minimizing curing time, while being molded as a single piece for reduced weight and production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If adhesive is applied without glass beads to reduce curing time, then curing time is reduced, but it becomes difficult to control the bond-line thickness uniformly
Solution Approach 1:
The patent incorporates protrusions (nubs) on the bonding surface before adhesive application. These protrusions pre-establish the desired bond-line thickness by limiting how much adhesive can be compressed, ensuring uniform thickness even when adhesive is applied without glass beads and without requiring precise control during the application process.
Solution Approach 2:
The patent changes the physical structure of the bonding surface by adding protrusions with specific dimensions. This structural parameter change allows the system to control adhesive thickness through the geometry of the protrusions rather than relying on adhesive formulation or application technique, enabling use of faster-curing adhesives while maintaining thickness control.
2Reliability
If excess adhesive is applied to ensure proper bonding, then bonding reliability is improved, but weight increases which is critical for aerospace applications
Solution Approach 1:
The protrusions are pre-formed on the bonding surface to define the maximum adhesive volume. This preliminary structural feature ensures that even when adhesive is applied generously, the bond-line thickness cannot exceed the protrusion height, preventing excess adhesive weight while ensuring sufficient adhesive is present for reliable bonding.
Solution Approach 2:
The patent introduces localized structural features (protrusions) at specific locations on the bonding surface. These localized elements control adhesive distribution and thickness only where needed for bonding, allowing the rest of the cable tie mount structure to remain lightweight without compromising bonding reliability.
3Ease of operation
If adhesive is applied without an applicator to reduce complexity, then ease of operation is improved, but pressure distribution becomes uneven leading to poor seating
Solution Approach 1:
The protrusions on the bonding surface automatically perform the function of defining bond-line thickness and ensuring proper seating. When adhesive is applied and the cable tie mount is pressed against the mounting surface, the protrusions self-limit the adhesive compression, ensuring uniform thickness without requiring an applicator or complex pressure distribution mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves an optimal adhesive bond-line thickness, reduces material weight, and minimizes production costs, ensuring secure cable management without compromising structural integrity, even in high-weight applications like aerospace vehicles.
Implementation Method 1
The cable tie mounts generally are provided with a resting surface for the cables to fall in, and small channels or slots provided in a transverse direction to said resting surface. Ties, such as zip ties are inserted through the channels or slots and closed around the cables to tie them in a tidy manner. Further, there are known techniques of fixing the bonding surface of the cable tie mount to a mounting surface which includes adhesive backing using peel-off sticker.
Data Source
AI summary
An adhesive based cable tie mount for attaching on a mounting surface and thereby mount cable ties to tie plurality of cable wires includes a top surface, a bottom surface, and a receiving cut-out portion formed between the top surface and the bottom surface. The top surface comprises a first end, a second end and a central portion for placing the cable wires. The top surface further has a predefined slanting towards a central portion. The bottom surface is configured to be attached with the mounting surface. A plurality of nubs of predefined dimension are disposed in a spaced apart manner on the bottom surface. The define a bond-line thickness between the bottom surface and sad mounting surface. The receiving cut-out portion is formed to accommodate the cable ties therein.