Cabled Midplane Layering for High Density and Low Signal Loss
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-speed network switches face challenges in achieving high connector density and minimizing signal loss due to the limitations of printed circuit board technologies, which struggle with increased interconnect lengths and require extensive mechanical support, making it difficult and costly to manufacture high-density cabled backplanes and midplanes with all-to-all interconnect patterns.
Innovation Solution
A method for fabricating high-density cabled backplanes and midplanes by sequentially adding wiring sub-layers, power distribution layers, and mechanical support layers, using a 'many-to-many' interconnect methodology, which allows for a repeatable and manufacturable process with minimal mechanical infrastructure, enabling efficient connector density and reduced signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If printed circuit board backplanes and midplanes are used to achieve high connector density, then connector density is improved, but signal loss increases due to extensive interconnect lengths
Solution Approach 1:
The patent divides the backplane or midplane into multiple separate cable assemblies, each connecting specific connector pairs. This segmentation allows for shorter, optimized interconnect lengths within each cable while achieving high overall connector density through the aggregated effect of multiple smaller connections rather than one extensive interconnect structure
Solution Approach 2:
The patent transitions from a planar PCB interconnect structure to a three-dimensional cabled assembly structure. By utilizing vertical stacking and layered cable arrangements, the system achieves high connector density in the vertical dimension while maintaining shorter horizontal interconnect lengths, thereby reducing signal loss
2Quantity of substance
If cabled backplane and midplane technologies are used to achieve high connector density, then connector density is improved, but space requirements and mechanical support needs increase
Solution Approach 1:
The patent implements nested cable assemblies where multiple cables are bundled and routed through shared pathways and support structures. Inner cables are positioned within outer cable bundles, and multiple wiring layers are nested within the same mechanical envelope, significantly reducing the overall space required while maintaining high connector density
Solution Approach 2:
The patent designs universal mechanical support structures and cable management systems that serve multiple functions simultaneously: providing structural support, organizing multiple cable bundles, enabling routing flexibility, and facilitating assembly/disassembly. This multi-functionality reduces the total component count and space requirements
3Stability of the object's composition
If extensive mechanical support is provided for cabled backplanes and midplanes, then structural stability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent incorporates pre-assembled cable bundles with pre-attached connectors and pre-positioned mechanical supports. These pre-assembled units are designed and tested independently before final integration, allowing for standardized manufacturing processes that reduce complexity while maintaining structural stability through pre-engineered support configurations
Solution Approach 2:
The patent utilizes flexible cable assemblies that can adapt their physical parameters (bending radius, routing paths, connection angles) to fit various structural configurations without requiring rigid, complex mechanical support structures. This flexibility allows simpler support designs that maintain stability while reducing manufacturing complexity
Data Source
AI summary
A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.