3D Cache-on-Memory Semiconductor Package for Dense Integration
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving smaller and more efficient packaging techniques for semiconductor dies as demand grows for shrinking electronic devices, with existing methods struggling to effectively integrate 2.5D and 3D memory stacked die systems.
Innovation Solution
The implementation of a semiconductor package that includes a processor die, a storage module with stacked cache and memory units, and a package substrate, utilizing conductive bumps and through vias for electrical connectivity, along with hybrid bonding techniques to enhance interconnect density and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional packaging techniques are used for semiconductor dies, then manufacturing simplicity is maintained, but integration density and device size reduction are limited
Solution Approach 1:
The patent implements nested packaging by placing one semiconductor die inside a cavity formed in another die. Specifically, a first die is formed with a cavity, and a second die is placed inside this cavity and encapsulated with encapsulant material. This nesting approach reduces the overall package volume while managing the complexity through systematic structural integration.
Solution Approach 2:
The patent transitions from planar 2D packaging to three-dimensional 2.5D and 3D packaging structures. By utilizing vertical stacking and embedding dies within cavities of other dies, the packaging architecture moves into the third dimension, enabling higher integration density and smaller footprint while systematically managing structural complexity.
2Quantity of substance
If 2.5D and 3D memory stacked die systems are integrated, then integration density improves, but manufacturing complexity increases
Solution Approach 1:
The patent segments the manufacturing process into distinct stages: forming cavities in first dies, placing second dies inside cavities, encapsulating with encapsulant material, and subsequent processing steps. This segmentation allows complex 2.5D and 3D stacked die systems to be manufactured through manageable, sequential operations, reducing overall manufacturing complexity while achieving high integration density.
Solution Approach 2:
The patent uses encapsulant material as an intermediary substance that fills cavities and bonds dies together in 2.5D and 3D stacked configurations. This intermediary material simplifies the manufacturing process by providing a unified bonding and filling mechanism that accommodates complex multi-die architectures without requiring intricate alignment and bonding procedures for each die interface.
3Productivity
If cache units are stacked over memory units, then data retrieval efficiency improves, but device structure complexity increases
Solution Approach 1:
The patent implements vertical stacking of cache units over memory units in the third dimension, creating 3D stacked memory architectures. This dimensional transition enables high-speed data retrieval by placing cache memory in close proximity to processing elements while maintaining manageable structural complexity through standardized vertical integration techniques and encapsulation methods.
Data Source
AI summary
A semiconductor package includes a processor die, a storage module and a package substrate. The storage module includes an array of cache units and an array of memory units stacked over one another, and electrically connected to the processor die, wherein the array of cache units is configured to hold copies of data stored in the array of memory units and frequently used by the processor die. The package substrate is on which the processor die and the storage module are disposed.