Cache-Region Power Connection Lines for Stable Multi-Core Voltage
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Solution Overview
Problem
Semiconductor devices face challenges in stably supplying operating voltage to multiple cores and power domains due to physical separation, leading to excessive heat generation and instability in power delivery.
Innovation Solution
Incorporating power connection lines that connect physically separated power lines within the same power domain, allowing for stable voltage supply across cores and domains, and utilizing a power management integrated circuit with voltage regulator modules to generate and transmit operating voltages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If power lines are physically separated to improve heat characteristics, then heat dissipation is improved, but power integrity and voltage stability deteriorate
Solution Approach 1:
The patent segments the chip into multiple semiconductor regions (first, second, third regions) with different functional purposes. Power lines are selectively connected or disconnected between these regions based on operational modes, allowing heat management and power integrity to be optimized independently in different spatial segments.
Solution Approach 2:
The patent implements dynamic reconfiguration of power line connections between semiconductor regions. A control circuit dynamically connects or disconnects power lines between regions based on operational requirements, enabling the system to adapt between high-performance mode (power lines connected) and heat-dissipation mode (power lines disconnected).
2Temperature
If power lines are spaced apart to manage heat, then thermal performance improves, but voltage supply stability deteriorates
Solution Approach 1:
The control circuit dynamically adjusts the connection state of power lines between semiconductor regions based on operational modes. When high voltage stability is required, power lines are connected; when heat dissipation is prioritized, power lines are disconnected, enabling adaptive optimization of both parameters.
Solution Approach 2:
The system changes the electrical connection parameter (connected/disconnected) of power lines between regions based on operational requirements. This parameter change allows the system to switch between states that optimize for either voltage stability or thermal performance.
3Temperature
If multiple semiconductor regions use separate power lines, then heat characteristics improve, but power delivery stability deteriorates
Solution Approach 1:
The chip is segmented into multiple independently controllable semiconductor regions. Each region can have its power line connection state independently adjusted, allowing selective thermal management while maintaining power delivery stability in regions that require it.
Solution Approach 2:
The system dynamically reconfigures power line connections between semiconductor regions based on operational modes. The control circuit monitors system state and adjusts connections in real-time, enabling power delivery stability when needed and heat dissipation when needed.
Data Source
AI summary
A semiconductor chip includes a first core region including a first core and a first power line configured to provide a first voltage to the first core, a second core region including a second core and a second power line configured to provide the first voltage to the second core, a cache region between the first core region and the second core region, the cache region including a cache and a third power line providing a second voltage to the cache, and arranged between the first core region and the second core region; and a first power connection line connecting the first power line to the second power line and arranged in the cache region.