CAD-Aligned EMC Imaging for Electronic Device Design Feedback
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Solution Overview
Problem
Existing design support tools fail to effectively feed back electromagnetic wave measurement results to the design of electronic devices, leading to potential EMC standard violations during testing.
Innovation Solution
A design support apparatus and method that superimposes electromagnetic wave images onto CAD drawings of electronic devices, aligning captured images with device shapes to facilitate feedback and alignment for design adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If electromagnetic wave measurement results are obtained through separate testing processes, then measurement accuracy is improved, but integration with design data and ease of analysis deteriorates
Solution Approach 1:
The patent merges electromagnetic wave measurement results with CAD design data by superimposing measurement data onto the corresponding CAD model. This integration allows designers to directly correlate measurement findings with specific design features, eliminating the need to switch between separate testing and design tools while maintaining measurement accuracy.
Solution Approach 2:
The patent introduces an image processing system as an intermediary that captures images of the electronic device under test and overlays electromagnetic wave measurement results onto these images. This intermediary layer facilitates the connection between physical measurement data and digital design representations, enabling intuitive analysis without compromising measurement precision.
2Reliability
If traditional separate testing and design processes are used, then measurement reliability is improved, but productivity and feedback efficiency deteriorate
Solution Approach 1:
The patent implements a feedback mechanism where electromagnetic wave measurement results are immediately visualized and overlaid on CAD drawings, providing real-time feedback to the design process. This allows designers to identify EMC issues directly on the design model and make corrective modifications without waiting for separate analysis steps, thereby improving productivity while maintaining measurement reliability.
Solution Approach 2:
The patent enables preliminary identification of EMC problems by superimposing measurement results on CAD data during the design phase. This allows designers to detect and address potential issues before finalizing the design or proceeding to production, improving both productivity and preventing future reliability issues.
3Measurement precision
If detailed electromagnetic wave analysis is performed separately, then measurement precision is improved, but device complexity and analysis difficulty increase
Solution Approach 1:
The patent combines detailed electromagnetic wave analysis data with visual CAD representations, merging complex measurement information into an intuitive graphical format. This integration maintains the precision of detailed analysis while reducing the perceived complexity by presenting data in a familiar visual context that designers can easily interpret.
Data Source
AI summary
A design support apparatus includes an acquisition unit configured to acquire an electromagnetic wave image in which a captured image obtained by capturing an electronic device and a map obtained by mapping, in a two-dimensional space, a measurement result of an electromagnetic wave radiated from the electronic device are superimposed, and a composition unit configured to cause a display unit to display a CAD drawing representing a shape of the electronic device and the electromagnetic wave image in a superimposed manner such that the CAD drawing and a device image that is an image of the electronic device in the captured image are aligned.