Calibrating Disk for Wafer Coating Positioning Stability
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Solution Overview
Problem
In semiconductor device fabrication, photolithography processes often result in defects due to bumping and scratching during the coating process, which decreases the yield of semiconductor devices.
Innovation Solution
A coating system with a calibrating disk and suction plane configuration that limits horizontal movement of supporting pins, allowing for precise positioning and vacuum simulation to prevent damage to wafers, including a calibration method to ensure proper alignment and vacuum values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If supporting pins are used to hold the wafer during coating process, then the wafer can be securely positioned, but the supporting pins may bump and scratch the wafer surface causing defects
Solution Approach 1:
The patent introduces a calibration disk as an intermediary object between the supporting pins and the wafer. The calibration disk with its specific geometric features (concentric circles, annular groove) serves as a mediator that allows the supporting pins to engage with it instead of directly with the wafer, thereby preventing direct contact and potential damage to the wafer surface while still providing stable positioning through the calibration disk's structured surface
2Productivity
If the coating system operates without precise calibration, then the process can be simpler and faster, but bumping and scratching defects occur during wafer movement and rotation
Solution Approach 1:
The patent implements a preliminary calibration action before the actual coating process. The calibration disk is positioned and calibrated in advance with precise geometric features that define the correct positioning and orientation. This preliminary setup ensures that when the actual wafer coating occurs, the supporting pins and suction plane are already properly aligned, preventing bumping and scratching defects during wafer movement and rotation while maintaining high processing efficiency
3Reliability
If the supporting pins are positioned closer to the suction plane, then wafer holding is more stable, but the risk of horizontal movement and scratching increases
Solution Approach 1:
The calibration disk serves as a mediator between the supporting pins and the suction plane. Its structured surface with concentric circles and annular groove provides a controlled interface that allows the supporting pins to engage at optimal positions for stability while the disk itself prevents excessive horizontal movement. The suction plane interacts with the calibration disk's surface features rather than directly with the pins, creating a stable yet controlled system that minimizes scratching risk
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents wafer damage and ensures proper positioning of supporting pins and suction planes, enhancing the yield of semiconductor devices by simulating the wafer location during coating processes.
Implementation Method 1
vacuuming the calibrating disk with the suction plane and output a vacuum value
Data Source
AI summary
A coating system includes supporting pins, a suction plane, and a calibrating disk. The suction plane is located between the supporting pins, and the calibrating disk is configured to dispose on the supporting pins or the suction plane. The calibrating disk includes a round top surface and a round bottom surface being opposite to the round top surface. The round bottom surface has a round plane and a dependable wall surrounding the round plane, and an edge of the round plane and an edge of the round bottom surface are concentric. The dependable wall is configured to limited horizontal movement of the supporting pins, and the round plane is configured to cover the suction plane. A calibration method of the coating system is also provided.