Calibration Plate for Component Mounting Apparatus
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Solution Overview
Problem
Existing component mounting apparatuses face challenges in precisely positioning components on large-area substrates without defined markings, requiring a method to achieve high placement accuracy and account for global substrate position data.
Innovation Solution
A method involving a component mounting apparatus with a bonding station, cameras, and a calibration plate with test chips to determine and correct positional deviations, using global substrate position data and image processing to ensure precise placement across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If component mounting apparatus is used on large-area substrates without substrate markings, then the working area must be enlarged to cover the entire substrate, but the placement precision deteriorates due to lack of local positioning references
Solution Approach 1:
The calibration plate is divided into multiple calibration positions distributed two-dimensionally across its surface. Each calibration position serves as an independent reference point for determining bond head positioning accuracy at different locations across the large working area, enabling precise calibration throughout the entire substrate surface.
Solution Approach 2:
A calibration plate with known calibration positions is introduced as an intermediary reference object. The calibration plate contains optical markings that serve as intermediate reference points between the bond head and the substrate, enabling indirect positioning and calibration across large areas where direct substrate markings are unavailable.
2Area of stationary object
If bond head working area is enlarged to cover entire substrate, then more components can be mounted, but the complexity of calibration increases due to covering larger area
Solution Approach 1:
The calibration plate serves multiple functions: it provides reference positions for calibration, contains optical markings for detection, and can be used repeatedly for calibration of the entire working area. The same calibration plate structure is used across all calibration positions, simplifying the calibration process despite the large working area.
Solution Approach 2:
The calibration plate is pre-prepared with known calibration positions and optical markings before the calibration process. This preliminary preparation of reference data simplifies the actual calibration operation, as the bond head positions can be directly compared against the pre-established calibration positions without requiring complex real-time calculations.
3Ease of manufacture
If substrate has no local markings at mounting places, then substrate design is simplified, but position determination becomes difficult requiring calculation from global features only
Solution Approach 1:
The calibration plate creates a copy of the reference position system that can be used during calibration. The calibration positions on the calibration plate replicate the positioning function that would otherwise require substrate markings, allowing position determination through optical comparison without modifying the substrate design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and accurate component placement on large-area substrates by calibrating the apparatus to account for global substrate features, ensuring high placement accuracy and covering a working area as large as or larger than the substrate.
Implementation Method 1
with the first camera taking an image of the test chip held by the bond head and determining the deviation of the actual position of the test chip from its target position
Implementation Method 2
with the second camera taking an image of the test chip placed on the calibration plate and determining a difference vector that describes a deviation of the actual position of the test chip from its target position
Data Source
AI summary
The invention concerns the calibration of a component mounting apparatus configured to mount components on a substrate whose mounting places do not contain local markings. The substrate contains either global substrate markings attached to its edge or other global features that can be used to mount the components. Calibration is carried out by means of a calibration plate which has several calibration positions distributed two-dimensionally over the calibration plate and provided with first optical markings, a test chip which has second optical markings, and a holder attached to the bonding station for temporarily accommodating the calibration plate. The number and arrangement of the calibration positions of the calibration plate and the number and arrangement of the mounting places of the substrate are—apart from possible exceptions—different from one another.