Calibration Substrate Sensor Arrays for Process Chamber Placement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for determining substrate placement in process chambers are limited in accuracy and efficiency, often requiring lengthy data collection or unreliable pattern transfer, which can result in incorrect substrate positioning and non-uniform processing.
Innovation Solution
A method and apparatus using a calibration substrate with embedded sensor arrays to calculate the center location and edge positions of the support member, determining an offset for precise substrate placement, and transmitting this information to a positioning robot for accurate substrate positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the substrate is viewed under a clear window and adjusted based on centering to the process kit, then the placement method is simple and quick, but the accuracy is limited because the process kit may not be well centered with respect to the support member
Solution Approach 1:
A calibration substrate with embedded sensors is introduced as an intermediary tool between the rough placement mechanism and the final accurate positioning. The calibration substrate includes sensors that directly measure the support member's position, serving as a mediator that translates rough placement into precise positioning without relying on the process kit's centering accuracy
Solution Approach 2:
The visual centering method under a clear window is replaced with an automated sensor-based measurement system. Sensors embedded in the calibration substrate electronically detect the support member's position and calculate the offset, substituting manual visual adjustment with automated computational positioning
2Measurement precision
If etch rate or uniformity data from already etched substrates is used to determine placement accuracy, then more accurate placement information can be obtained, but several hours are required to collect the necessary data
Solution Approach 1:
A calibration substrate with embedded sensors is used to perform placement determination in advance, before actual substrate processing begins. The sensors pre-measure the support member's position and calculate the offset, eliminating the need to wait hours for etch rate data from processed substrates
Solution Approach 2:
The time-consuming etch rate measurement process is replaced with immediate sensor-based position detection. The embedded sensors directly measure the support member's location and compute the offset instantly, substituting lengthy empirical data collection with rapid electronic measurement
3Measurement precision
If the pattern of the support member is transferred onto a substrate by transferring particles or physically damaging the substrate, then accurate placement can be achieved, but the method is unreliable and can damage the substrate
Solution Approach 1:
A calibration substrate with embedded sensors serves as an intermediary that measures the support member's position without requiring pattern transfer to the actual substrates. The sensors directly detect the support member's location, eliminating the unreliable pattern transfer process
Solution Approach 2:
The physical pattern transfer method (particle transfer or physical damage) is replaced with non-contact sensor-based measurement. The embedded sensors electronically detect the support member's position, substituting mechanical pattern transfer with field-based sensing that causes no damage to substrates
Data Source
AI summary
Methods for determining substrate placement in a process chamber are provided herein. In some embodiments, a method for determining substrate placement in a process chamber includes receiving sensor readings from a plurality of sensor arrays attached to the calibration substrate, calculating locations of a plurality of edge locations of a support member beneath the sensors based on the sensor readings, calculating a center point location of the support member based on the locations of the plurality of edge locations of the support member and determining an offset between the center point location and a location of the center of the calibration substrate.