Cam-Actuated Clipping Mechanism for Residue-Free Substrate Holding
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Solution Overview
Problem
Existing substrate holding mechanisms in industries like semiconductor and solar cell production face challenges in securely fixing and rinsing large, thin substrates due to complex and bulky designs that hinder chemical and drying processes, leading to residue issues and limited flexibility.
Innovation Solution
A clipping mechanism with a flexible clipping bracket and independent actuation unit, featuring a rotatable actuation spindle with cams, allows precise adjustment of arm positions for secure substrate holding and easy rinsing and drying, preventing residue formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complex mechanical clamping mechanism like a hinged frame is used to secure the substrate, then the substrate can be held firmly in place, but the mechanism becomes bulky and shields large parts of the substrate corners from the process, making chemical rinsing difficult and leading to residue formation
Solution Approach 1:
The clipping mechanism is divided into separate independent clips that can be positioned precisely without interfering with each other, allowing each clip to secure the substrate without creating bulky structures that block process access to substrate surfaces
Solution Approach 2:
The clips are designed with specific local geometries that provide secure holding force only at the contact points with the substrate, while leaving the rest of the substrate surface completely accessible to chemical processes, rinsing, and drying operations
2Device complexity
If individual clips are used to hold the substrate in place, then the mechanism becomes simpler, but the clips do not permit thorough rinsing and water droplets remain behind during drying, leading to residue formation
Solution Approach 1:
Instead of designing clips that hold the substrate and hoping rinsing works, the clip geometry is specifically designed to be rinsing-friendly from the start, with smooth surfaces and angles that prevent water droplet accumulation, effectively inverting the design priority from pure mechanical holding to holding plus rinsing compatibility
3Device complexity
If arms are moved and controlled through a common mechanism, then the control structure is simplified, but the arms cannot move independently, leading to limited degree of freedom in the fixing and holding mechanism
Solution Approach 1:
The control system is segmented into independent control units for each clip or arm, allowing each component to move and position itself independently to adapt to different substrate sizes, shapes, and positioning requirements, rather than being constrained by a single common mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The mechanism provides reliable, residue-free substrate handling and processing by evenly distributing holding force, enabling efficient automatic loading/unloading and uniform surface treatment without shielding substrate areas, thus improving productivity and safety.
Implementation Method 1
A first portion or first cam (16) of the actuation unit (12) is moveable in contact with the first arm (13) to move the first arm (13) between the receiving position and the fastening position. A second portion or second cam (17) of the actuation unit (12) is moveable in contact with the second arm (14) to move the second arm (14) between the receiving position and the fastening position.
Data Source
Figure 1~2
Figure 3a~4
Figure 5~6b
AI summary
The disclosure relates to a clipping mechanism for fastening a substrate for a surface treatment of the substrate, a clipping module for holding a substrate for a surface treatment of the substrate and a method for assembling a clipping mechanism for fastening a substrate for a surface treatment of the substrate. The clipping mechanism for fastening a substrate for a surface treatment of the substrate comprises a clipping bracket and an actuation unit. The clipping bracket comprises in a cross-section a first arm and a second arm. The first arm is moveable relative to the second arm to a receiving position for the substrate with a receiving distance between the first arm and the second arm. The first arm is moveable relative to the second arm to a fastening position for the substrate with a fastening distance between the first arm and the second arm. The fastening distance is smaller than the receiving distance. The actuation unit is at least partially surrounded by the clipping bracket.