Camera Actuator Layout for Slim OIS and Magnetic Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing camera modules face challenges in achieving ultra-slim, ultra-small, and high-resolution designs due to space constraints for optical image stabilizers (OIS) actuators, magnetic interference between AF and OIS components, and difficulties in testing the mounting state of Hall sensors when the driver IC and Hall sensor are on the same substrate.
Innovation Solution
A camera actuator design utilizing a repulsive force between first and second magnetic bodies to maintain a combination with a housing, allowing for ultra-slim and ultra-small camera modules, and includes a tilting guide part for precise OIS function without magnetic interference, with Hall sensors directly connected to test pads on the same substrate for reliable mounting verification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If actuators for OIS are disposed around the lens to enable optical image stabilization, then image stabilization function is achieved, but space for arranging actuators and lens tilting is severely constrained in ultra-slim camera modules
Solution Approach 1:
The patent moves the OIS actuator from a lateral arrangement around the lens to a vertical stacking arrangement below the image sensor. This dimensional repositioning allows the actuator to operate in the thickness direction rather than the lateral plane, effectively resolving the space conflict in ultra-slim camera modules while maintaining the optical image stabilization function.
Solution Approach 2:
The patent integrates the OIS actuator structure within the existing camera module stacking architecture, nesting the actuator below the image sensor rather than placing it around the lens. This nesting approach allows multiple functional components to be vertically stacked, maximizing space utilization in the lateral plane while maintaining OIS capability.
2Illumination intensity
If lens size is increased to receive more light for high pixel count cameras, then light reception capability is improved, but space occupied by OIS actuator limits further lens size increase
Solution Approach 1:
By relocating the OIS actuator to the vertical stacking direction below the image sensor, the patent frees up lateral space that can be allocated to a larger lens diameter. This dimensional repositioning allows the lens to be enlarged for better light reception without being constrained by the lateral space previously occupied by the actuator.
3Volume of stationary object
If magnet for OIS and magnet for AF or zoom are disposed close to each other to save space, then module size is reduced, but magnetic field interference occurs between the magnets
Solution Approach 1:
The patent extracts the OIS magnet from its traditional lateral position near the lens and relocates it to the vertical stacking direction below the image sensor. This separation in spatial arrangement reduces magnetic field interference between the OIS magnet and AF/zoom magnets while maintaining compact module dimensions through vertical integration.
Solution Approach 2:
By positioning the OIS magnet in the vertical direction rather than laterally adjacent to other magnets, the patent creates sufficient magnetic field separation without increasing overall module volume. This dimensional separation effectively eliminates magnetic interference while maintaining space efficiency.
4Ease of manufacture
If driver IC and Hall sensor are mounted on different substrates to simplify testing, then mounting state of Hall sensor can be tested, but noise increases and volume is not minimized
Solution Approach 1:
The patent integrates the driver IC and Hall sensor onto the same substrate, combining previously separate components into a unified structure. This merging reduces noise by eliminating inter-substrate signal transmission, minimizes overall volume, and maintains testing capability through appropriately designed test pads and connection structures on the integrated substrate.
5Device complexity
If Hall sensor is mounted through surface mount technology to integrate with driver IC on same substrate, then volume is minimized, but about 3% to 4% of short-circuit defects occur in the SMT process and mounting state cannot be directly tested
Solution Approach 1:
The patent incorporates test pads directly on the substrate before Hall sensor mounting, establishing preliminary test access points that enable post-mounting verification of Hall sensor connectivity and functionality. This preliminary preparation allows detection of mounting defects without requiring substrate separation, maintaining the benefits of integrated mounting while enabling reliability verification.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables efficient actuator placement without increasing module size, improves Hall sensor testing reliability, enhances thrust and sensitivity, and prevents magnetic interference, ensuring stable OIS performance with low power consumption.
Implementation Method 1
a repulsive force between a first magnetic body and a second magnetic body
Implementation Method 2
a Hall sensor is used to detect the position and movement of the lens
Implementation Method 3
the electromagnetic force is affected by a separation distance between the coil and the magnet
Data Source
AI summary
An embodiment of the present invention provides a camera actuator comprising: a housing; a first member combined with the housing; a mover including an optical member; a first magnetic body disposed in the first member; a second magnetic body disposed in the mover; and a tilting-guiding part for guiding titling of the mover, wherein the mover comprises a holder combined with the optical member and a second member combined with the holder, and the tilting-guiding part is closely adhered to the first member and the holder by repulsion between the first magnetic body and the second magnetic body.


