Camera Actuator Substrate Layout for Slim OIS Camera Modules
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Solution Overview
Problem
Existing camera apparatuses face challenges in providing space for actuators due to ultra-slim and ultra-small designs, leading to limitations in image stabilization, magnetic field interference, and increased thickness, especially with high-resolution cameras.
Innovation Solution
A camera apparatus design that includes a main substrate with grooves on both surfaces for flexible circuit substrates, allowing space for an image sensor connection without increasing thickness, and separate actuators to prevent magnetic field interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the camera apparatus is designed to be ultra-slim and ultra-small, then the size and thickness are reduced, but there is insufficient space for actuators and lens movement required for image stabilization
Solution Approach 1:
The groove is formed inside the first main substrate, creating a nested structure where the connection substrate is disposed within the groove. This nesting approach allows the connection substrate to be positioned within the existing substrate volume without increasing the overall camera apparatus thickness, thereby providing necessary space for connections while maintaining the ultra-slim design.
Solution Approach 2:
The groove extends in the thickness direction (from second surface toward first surface), utilizing the Z-axis dimension to create space for the connection substrate. This dimensional approach allows space creation without increasing the planar area (X-Y plane), thus maintaining the ultra-small footprint while accommodating necessary components.
2Object-affected harmful factors
If separate actuators are used for OIS, AF, and zooming functions, then magnetic field interference is reduced, but the device complexity and space requirements increase
Solution Approach 1:
The connection substrate is extracted and disposed separately within the groove, physically separating it from the first main substrate where the image sensor is mounted. This separation prevents magnetic field interference between different functional components while maintaining a compact structure, as the connection substrate is integrated within the groove rather than being a separate external component.
3Illumination intensity
If the lens size is increased to increase light reception, then the amount of received light increases, but the space occupied by OIS actuators limits the lens size increase
Solution Approach 1:
The connection substrate is nested within the groove of the first main substrate, utilizing the thickness direction space. This nesting creates additional available area on the first main substrate surface, allowing for a larger lens to be mounted without increasing the overall camera module footprint, thus enabling increased light reception capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables ultra-slim, ultra-small, and high-resolution cameras with stable image stabilization and reduced magnetic interference, improving assembly reliability and simplifying bonding processes.
Implementation Method 1
a moving distance of a lens assembly is properly adjusted through a shape of a driving coil
Implementation Method 2
When the zooming function, the AF function, and the OIS function are all included in the camera apparatus, there is a problem that an OIS magnet and an AF or zoom magnet are disposed close to each other to cause magnetic field interference
Data Source
AI summary
As an embodiment of the present invention, a camera apparatus is disclosed, the apparatus including: a camera actuator; a main substrate; and an image sensor disposed between the camera actuator and the main substrate along the optical axis direction, wherein the main substrate includes: a first main substrate including a first surface having the image sensor mounted thereon and a second surface opposite to the first surface; and a connection substrate connected to the first main substrate, and wherein a groove is formed on one side surface of the first main substrate, the connection substrate is disposed in the groove, and the first main substrate includes an overlapping area in which a portion of the groove and the first surface overlap each other in the direction running from the second surface to the first surface.