Anti-Shake Camera Assembly Using Flexible PCB Suspension
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Solution Overview
Problem
Existing camera assemblies in electronic devices face challenges in assembling complexity due to the need for metal suspension wires and circuit board bending to compensate for camera shake, which complicates the integration of chip anti-shake functions.
Innovation Solution
A camera assembly design utilizing a flexible circuit board, elastic members, and a coil that cooperates with a permanent magnet to drive a photosensitive chip for anti-shake, eliminating the need for metal suspension wires and circuit board bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal suspension wires are used to suspend the photosensitive chip for chip anti-shake, then the photosensitive chip can be moved to compensate for optical path loss, but the assembling difficulty of the camera assembly greatly increases
Solution Approach 1:
The patent removes the metal suspension wires from the system and replaces them with a flexible circuit board that integrates both the suspension and circuit connection functions. This extraction of the problematic component eliminates the need for complex wire suspension while maintaining the chip anti-shake capability through the flexible board's ability to accommodate chip movement.
Solution Approach 2:
The flexible circuit board merges two previously separate functions: mechanical suspension (previously done by metal wires) and electrical connection (previously done by rigid circuit boards). This consolidation simplifies the assembly structure and reduces manufacturing complexity while preserving the photosensitive chip's movement capability for shake compensation.
2Reliability
If the circuit board connected with the photosensitive chip is bent to facilitate chip movement, then the chip can be suspended for anti-shake, but the assembling difficulty greatly increases
Solution Approach 1:
The flexible circuit board is designed with dynamic flexibility, allowing it to bend and deform as the photosensitive chip moves during shake compensation. This dynamic capability is built into the board's structure, eliminating the need for manual bending during assembly and simplifying the manufacturing process while maintaining anti-shake functionality.
Solution Approach 2:
The patent employs a flexible circuit board that utilizes flexible thin film technology to accommodate the photosensitive chip's movement. This flexible film structure naturally adapts to chip displacement without requiring complex bending operations during assembly, thereby reducing manufacturing difficulty while preserving the anti-shake function.
3Ease of manufacture
If a flexible circuit board is used to connect the photosensitive chip, then the assembling difficulty is reduced, but the device thickness may increase
Solution Approach 1:
The flexible circuit board is designed with optimized dimensional parameters, including its length, width, and flexibility characteristics, to achieve the right balance between ease of assembly and minimal thickness increase. By carefully controlling these parameters, the board provides sufficient flexibility for chip movement while maintaining a compact overall device thickness.
Solution Approach 2:
The use of thin film technology in the flexible circuit board allows it to provide the necessary flexibility and movement accommodation while occupying minimal space in the thickness direction. This thin film structure reduces the overall device thickness increase compared to rigid alternatives, achieving a compromise between manufacturability and compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces assembling difficulty and ensures stable chip movement without increasing device thickness, while effectively compensating for camera shake.
Implementation Method 1
where being energized, the first coil cooperates with a permanent magnet of a magnetic field where the first coil is located to drive the first circuit board to drive the photosensitive chip to move
Implementation Method 2
fixed ends of the plurality of first elastic members are fixedly mounted on the base, and free ends of the plurality of first elastic members are suspended; the first circuit board is mounted on a suspension rack formed by the plurality of first elastic members
Data Source
AI summary
A camera assembly and an electronic device. The camera assembly includes: a first circuit board, a flexible circuit board, a base, a plurality of first elastic members, a first coil, and a photosensitive chip; fixed ends of the plurality of first elastic members are fixedly mounted on the base, and free ends of the plurality of first elastic members are suspended; the first circuit board is mounted on a suspension rack formed by the plurality of first elastic members, and the first coil and the photosensitive chip are provided on the first circuit board; one end of the flexible circuit board is fixedly connected to the first circuit board, and the other end of the flexible circuit board is fixedly connected to the base.