Camera Assembly Ground Plane Access Opening EMI Reduction
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Solution Overview
Problem
Existing camera assemblies face unpredictable electromagnetic interference (EMI) due to externally applied electrically conductive adhesives, leading to unreliable connections and increased failure rates.
Innovation Solution
A camera assembly with a printed circuit board (PCB) featuring an electrically conductive layer defining a ground plane, coupled to a camera body with a dielectric and conductive layer, where an electrically conductive material within a ground plane access opening ensures a reliable connection, enhancing electromagnetic compatibility (EMC).
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If externally applied spot or blob of electrically conductive adhesive is used to couple metal or metalized surface to ground, then connection is established, but connection reliability becomes unpredictable
Solution Approach 1:
The patent applies preliminary action by pre-forming the electrically conductive adhesive pattern directly on the PCB ground plane during PCB manufacturing, rather than applying adhesive externally during assembly. This ensures the adhesive is already in position and properly formed before components are assembled, eliminating variability in the bonding interface.
Solution Approach 2:
The patent merges the ground plane and electrically conductive adhesive into a single integrated structure on the PCB. The adhesive pattern is formed as part of the ground plane layer, combining two previously separate elements (ground plane and adhesive) into one unified component that ensures consistent electrical connection.
2Object-affected harmful factors
If shielding components is increased to reduce electromagnetic interference, then EMI protection is improved, but device complexity increases
Solution Approach 1:
The PCB ground plane serves multiple functions simultaneously: it provides the electrical ground connection, acts as the shielding structure to block EMI, and incorporates the adhesive pattern for mechanical bonding. This multi-functionality eliminates the need for separate shielding components, reducing overall device complexity while maintaining EMI protection.
Solution Approach 2:
The patent combines the ground plane and EMI shielding function into a single integrated structure. The conductive adhesive pattern on the ground plane creates continuous electrical connection that provides both mechanical bonding and electromagnetic shielding, eliminating the need for additional separate shielding components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides increased reliability and reduced EMI by ensuring a consistent and robust connection between the electrically conductive layer and the ground plane, improving the yield and functionality of camera assemblies.
Implementation Method 1
an electrically conductive material within the ground plane access opening coupling the electrically conductive layer to the ground plane
Data Source
AI summary
A camera assembly may include a printed circuit board (PCB), an image sensor carried by the PCB, and an electrically conductive layer carried by the PCB defining a ground plane. The camera assembly may also include a lens assembly, and a camera body that includes a dielectric layer and an electrically conductive layer thereon. The camera body may have a lens assembly opening aligned between the image sensor and the lens assembly and may also have a ground plane access opening therein aligned with the ground plane. The camera assembly may also include an electrically conductive material within the ground plane access opening coupling the electrically conductive layer to the ground plane.