Camera Assembly Packaging Method for Ultra-Thin Lens Modules
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Solution Overview
Problem
Existing lens modules face challenges in miniaturization and reducing thickness while maintaining high imaging quality, as the separation of photosensitive chips and peripheral components leads to increased dimension and reduced signal transmission speed, impacting operational performance.
Innovation Solution
Integration of photosensitive chips and functional components within an encapsulation layer with a redistribution layer structure, which reduces physical and electrical connection distances, eliminating the need for circuit boards and enhancing signal transmission speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If photosensitive chips and peripheral components are separated on different circuit boards, then device complexity is reduced and ease of manufacture is improved, but the total dimension increases and signal transmission speed decreases
Solution Approach 1:
The patent merges the photosensitive chip and peripheral components onto a single substrate (PCB or flexible circuit board), eliminating the need for separate circuit boards. This integration reduces the overall device dimension while maintaining manufacturing feasibility through standardized mounting processes.
Solution Approach 2:
The patent arranges peripheral components around the photosensitive chip in a nested configuration, placing resistors, capacitors, and other components in the available space surrounding the central photosensitive element. This maximizes space utilization and minimizes the overall footprint of the device.
2Ease of operation
If photosensitive chips and peripheral components are separated on different circuit boards, then ease of manufacture is improved, but signal transmission speed decreases
Solution Approach 1:
By combining photosensitive chips and peripheral components on the same substrate, the patent minimizes the physical distance for signal transmission. This integration eliminates inter-board connections and reduces signal path length, thereby improving signal transmission speed while maintaining ease of manufacture through standardized mounting techniques.
3Volume of moving object
If lens module thickness is reduced for miniaturization, then volume is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs flexible circuit boards instead of rigid PCBs, allowing the device to achieve ultra-thin profiles while maintaining structural integrity. The flexibility of the thin film substrate enables reduced thickness without compromising manufacturing feasibility, as it can conform to space constraints while still supporting component mounting and electrical connections.
Solution Approach 2:
The patent transitions from traditional rigid PCB mounting to flexible substrate integration, changing the dimensional characteristics of the support structure. This allows the device to achieve reduced thickness in the Z-dimension while distributing stress and maintaining electrical connectivity through the flexible medium.
4Reliability
If photosensitive chip imaging area is increased to improve imaging capability, then area is increased, but device dimension increases
Solution Approach 1:
The patent utilizes flexible circuit board technology to accommodate larger photosensitive chip imaging areas without proportionally increasing device dimensions. The flexibility allows the layout to optimize component placement and signal routing in three-dimensional space, enabling larger imaging areas to be integrated within compact form factors through non-planar arrangements.
Data Source
AI summary
The present disclosure provides a method for packaging a camera assembly. The method includes: providing a photosensitive chip; mounting an optical filter on the photosensitive chip; temporarily bonding the photosensitive chip and functional components on a carrier substrate, where the photosensitive chip has soldering pads facing away from the carrier substrate and the functional components have soldering pads facing toward the carrier substrate; forming an encapsulation layer covering the carrier substrate, the photosensitive chip, and the functional components, and exposing the optical filter; after the encapsulation layer is formed, removing the carrier substrate; and after the carrier substrate is removed, forming a redistribution layer structure on a side of the encapsulation layer facing away from the optical filter to electrically connect the soldering pads of the photosensitive chip with the soldering pads of the functional components.