Contamination-Proof Camera Assembly for Precise Sensor Alignment
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Solution Overview
Problem
Existing methods for manufacturing automotive cameras fail to achieve the required alignment accuracy of +/−1 degree for pitch, yaw, and roll angles, while maintaining high cleanliness and precision, leading to increased process risks, costs, and extended times due to stringent optical setup specifications, especially for augmented reality applications.
Innovation Solution
The method involves mounting the camera objective on a carrier with a contamination-proof space formed between the carrier and the objective housing, allowing precise alignment of the camera sensor relative to the housing, reducing the surface area requiring high cleanliness and minimizing mechanical stresses, and using a contamination-proof space to shield against particle entry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If high cleanliness levels are maintained for all components throughout the complete value stream, then optical precision and alignment accuracy are improved, but process costs and process time increase significantly
Solution Approach 1:
The invention divides the camera system into two functional segments: a contamination-proof optical segment (objective, sensor, housing) and a non-contamination-critical electronic segment (printed circuit board). By mounting the objective directly to the housing and enclosing it in a contamination-proof space, the patent isolates the cleanliness-critical components from the manufacturing process, allowing the printed circuit board to be assembled separately under less stringent conditions. This segmentation enables parallel processing and reduces overall process time while maintaining optical precision.
2Manufacturing precision
If high cleanliness levels are maintained for all components throughout the complete value stream, then optical precision and alignment accuracy are improved, but manufacturing costs increase
Solution Approach 1:
The patent applies different cleanliness requirements to different spatial zones and components: the contamination-proof space containing the objective and sensor requires high cleanliness, while the printed circuit board and its mounting area can tolerate lower cleanliness levels. This local differentiation of quality standards allows manufacturing resources to be concentrated where they are most critical (optical path) while reducing costs in non-critical areas, thereby achieving high alignment accuracy without proportionally high manufacturing costs across the entire system.
3Manufacturing precision
If alignment accuracy below +/−1 degree is achieved for pitch, yaw, and roll angles, then optical performance is improved, but mechanical stress on components increases
Solution Approach 1:
The patent extracts the alignment function from the printed circuit board mounting process and implements it directly in the contamination-proof space between the objective housing and the housing body. By providing dedicated alignment features (such as precision-machined surfaces,定位 holes, or mechanical stops) within the contamination-proof assembly, the system achieves sub-1-degree alignment accuracy through precise mechanical positioning rather than relying on flexible PCB mounting methods, thereby reducing mechanical stress on the optical components while maintaining high alignment precision.
Data Source
AI summary
A method of manufacturing an objective carrier assembly includes mounting a camera objective on a carrier. The camera objective includes an objective housing and at least one lens. The carrier includes at least one camera sensor. A contamination-proof space is formed between the carrier and the objective housing. Boundaries of the contamination-proof space are at least partially formed by portions of the carrier, the objective housing, and at least one optical component of the camera objective. The camera sensor is enclosed in the contamination-proof space.