Vehicular Camera Assembly With Thermally Conductive PCB Adhesive

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Solution Overview

Problem

Existing vehicle imaging systems face challenges in efficiently dissipating heat generated by imaging components, leading to potential operational issues and performance degradation due to excessive temperatures, especially in extreme environmental conditions.

Innovation Solution

Incorporating a thermally conductive adhesive between the imager PCB and the camera housing or lens barrel to facilitate heat dissipation, eliminating the need for additional thermal interface materials and reducing the risk of lens fogging or condensation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If non-thermally conductive adhesive is used to attach imager PCB to camera housing, then optical path protection is maintained, but heat dissipation is hindered causing elevated temperatures

Engineering Contradiction:

Improvetemperature of imaging componentsVSAvoidperformance reliability of imaging sensor

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent changes the thermal conductivity parameter of the adhesive material from non-thermally conductive to thermally conductive. This allows the adhesive to simultaneously perform its primary function of bonding the imager PCB to the camera housing while also serving as a thermal management solution to conduct heat away from the imaging components, thereby resolving the temperature-reliability contradiction.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The adhesive is designed to perform multiple functions: mechanical bonding of components and thermal conduction for heat dissipation. By making the adhesive thermally conductive, it becomes a multi-functional material that eliminates the need for separate thermal interface materials, thereby improving heat dissipation while maintaining structural integrity and optical path protection.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If additional thermal interface materials are added to improve heat dissipation, then temperature control improves, but device complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidnumber of components in camera assembly

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the bonding function and thermal conduction function into a single thermally conductive adhesive material. This eliminates the need for separate thermal interface materials layered between components, thereby improving heat dissipation while reducing the total number of components and simplifying the overall device structure.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The thermally conductive adhesive serves as a universal material that simultaneously provides mechanical attachment and thermal management functions. This multi-functionality reduces device complexity by eliminating redundant components that would otherwise be needed for both bonding and heat dissipation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If thermally conductive adhesive is used for heat dissipation, then temperature control improves, but risk of condensation and fogging increases

Engineering Contradiction:

Improvetemperature range of imaging componentsVSAvoidcondensation and fogging on optical elements

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality control by positioning the thermally conductive adhesive specifically at the interface between the imager PCB and camera housing, away from the optical path. This localized application ensures effective heat dissipation from electronic components while preventing thermal interference with optical elements, thereby avoiding condensation and fogging issues.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively maintains safe operating temperatures for imaging components, enhances system performance, and reduces the risk of lens contamination, while potentially eliminating the need for lens heaters and allowing for smaller camera designs.

Implementation Method 1

heat generated by the imager is dissipated away from the vehicular camera assembly and drawn away from the first side of the imager PCB at least in part through the thermally conductive adhesive and the first portion of the camera housing

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12627872B2Vehicular camera assembly with thermally conductive adhesive interface

Publication Date: 2026.05.12 MAGNA ELECTRONICS INC

AI summary

A vehicular camera assembly includes a printed circuit board (PCB) and a camera housing having a first housing portion with a lens barrel that accommodates a lens. An imager at the PCB faces the lens. At least one of (i) the PCB is attached at the first housing portion via a thermally conductive adhesive and (ii) the lens barrel is attached at the first housing portion via the thermally conductive adhesive. The PCB is thermally conductively connected to the first housing portion and, while the vehicular camera assembly is electrically operated to capture image data, heat generated within the camera housing is drawn away from the PCB at least in part through the thermally conductive adhesive and the front housing portion.