Integrated Camera Module Base for Tilt Control and Mold Filling

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Solution Overview

Problem

Camera modules suffer from assembly tilt due to processing tolerances and adhesive glue inconsistencies, affecting imaging quality, and molded bases face issues like poor exhaust during injection molding, impacting production efficiency.

Innovation Solution

A molded base design with differential connecting portions and integrated lens and chip mounting surfaces, along with strategic adhesive application, to reduce tilt and improve molding efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If components are mounted separately on different bases with adhesive glue, then manufacturing cost is reduced, but assembly accuracy deteriorates due to tolerance accumulation and tilt

Engineering Contradiction:
Improvemanufacturing costVSAvoidassembly accuracy
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent merges the lens holder and mounting base into a single integrated molded base structure. The lens module is directly mounted on the molded base without requiring a separate lens holder, eliminating multiple adhesive bonding steps and tolerance accumulation interfaces. This integration maintains manufacturing simplicity while significantly improving assembly accuracy and reducing tilt between the lens module and photosensitive chip.

Inventive Principle:
Principle #5Merging (Combining)

2Manufacturing precision

If a molded base is used to reduce cost and improve integration, then manufacturing precision improves, but molding quality deteriorates due to poor exhaust during injection molding

Engineering Contradiction:
Improveassembly accuracyVSAvoidmolding quality
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The molded base is segmented into multiple regions with varying wall thicknesses: a first region with greater thickness and a second region with lesser thickness. This segmentation creates natural exhaust channels during injection molding, allowing air and volatiles to escape efficiently from the thinner regions. The segmented design resolves the exhaust problem while maintaining the integrated structure's assembly accuracy benefits.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the molded base are designed with different wall thicknesses to optimize both molding and assembly functions. The first region has greater thickness to provide structural support and mounting stability, while the second region has lesser thickness to facilitate exhaust during molding. This local quality variation ensures both molding quality and assembly precision are achieved simultaneously.

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If the molded base structure is simplified for cost reduction, then ease of manufacture improves, but molding efficiency deteriorates due to poor exhaust

Engineering Contradiction:
Improvemanufacturing costVSAvoidmolding efficiency
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The molded base incorporates segmented wall thickness regions that automatically function as exhaust channels during injection molding. The thinner second region allows air and volatiles to escape efficiently, preventing defects and rework. This segmentation maintains structural simplicity for cost-effectiveness while dramatically improving molding efficiency by eliminating exhaust-related production delays and defects.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20260082114A1Molded base, camera module and electronic device
Publication Date: 2026.03.19 NINGBO SUNNY OPOTECH CO LTD
  • US20260082114A1 patent drawing
  • US20260082114A1 patent drawing
  • US20260082114A1 patent drawing

AI summary

This application relates to a molded base, a camera module and electronic device. The molded base comprises: a first mounting portion having a lens mounting surface, wherein the first mounting portion comprises a first portion and a second portion; a second mounting portion having a first side wall and a second side wall which are opposite to each other in the first direction, wherein the first portion and the first side wall are spaced in the first direction, the second portion and the second side wall are spaced in the first direction, and the second mounting portion further has a chip mounting surface located between the first side wall and the second side wall; a first connecting portion which is connected to the first portion of the first mounting portion and the first side wall of the second mounting portion; and a second connecting portion which is connected to the second portion of the first mounting portion and the second side wall of the second mounting portion, and the sectional area of the first connecting portion being perpendicular to the first direction is larger than the sectional area of the second connecting portion being perpendicular to the first direction. The molded base according to the application may facilitate the molding liquid to rapidly flow to the area where the second mounting portion is located in the mold, thereby increasing the molding yield of the molded base.