Camera Module Bracket with Embedded Electronic Components

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Solution Overview

Problem

Camera module designs face challenges in reducing size as the number of electronic components increases, with existing configurations not efficiently utilizing space and potentially interfering with the photosensitive chip's light-sensing path.

Innovation Solution

The electronic components are strategically arranged on the inner surface of the bracket's side wall, using conductive adhesive layers or flexible printed circuit boards to establish electrical connections, allowing for compact placement without additional fixing structures and minimizing interference with the photosensitive chip.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If electronic components are arranged around the photosensitive chip on the PCB, then electrical connections can be established, but the camera module size cannot be reduced despite increasing component density

Engineering Contradiction:
Improvecamera module sizeVSAvoidelectronic component arrangement
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent transitions from planar arrangement of electronic components on the PCB to three-dimensional arrangement on the bracket structure. The bracket provides vertical and lateral surfaces for mounting components, enabling spatial utilization beyond the two-dimensional PCB plane. This dimensional transition allows compact integration while maintaining electrical connectivity through flexible circuits and conductive adhesives.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The bracket serves as an intermediary structure between the PCB and electronic components. Instead of directly mounting components on the PCB, the patent uses the bracket as a intermediate platform that holds components and provides mounting surfaces. This intermediary approach enables flexible component placement and simplifies electrical connections through the use of flexible printed circuits and conductive adhesive layers.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If additional fixing structures are used to secure electronic components, then component stability is improved, but assembly complexity and space requirements increase

Engineering Contradiction:
Improvecomponent stabilityVSAvoidfixing structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The bracket structure provides self-service fixation for electronic components through its inherent geometric features. The bracket's side walls and mounting surfaces naturally constrain components in place without requiring additional external fixing structures. The integration of mounting functions into the bracket's basic structure eliminates the need for separate fastening elements, simplifying both design and assembly.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent merges the support and fixation functions into the single bracket structure. Rather than having separate support elements and fixing elements, the bracket simultaneously provides both functions through its integrated design. The bracket holds electronic components while its structural features provide inherent stabilization, combining multiple functions into one component.

Inventive Principle:
Principle #5Merging (Combining)

3Volume of moving object

If electronic components are placed close to the photosensitive chip, then space utilization is improved, but light interference may occur

Engineering Contradiction:
Improvespace utilizationVSAvoidlight interference
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent extracts electronic components from the immediate vicinity of the photosensitive chip's light path. By placing components on the bracket structure rather than on the PCB near the chip, the design removes potential light-interfering elements from the critical optical path. This separation maintains compact overall size while eliminating light interference risks.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables miniaturization of the camera module by optimizing space utilization, preventing light interference, and simplifying assembly, while maintaining effective electrical connections and stability.

Implementation Method 1

The electronic component is electrically coupled to the circuit board

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11736785B2Camera module
Publication Date: 2023.08.22 TRIPLE WIN TECH (SHENZHEN) CO LTD
  • US11736785B2 patent drawing
  • US11736785B2 patent drawing
  • US11736785B2 patent drawing

AI summary

A camera module includes a circuit board, a bracket arranged on the circuit board, and at least one electronic component embedded in the bracket and/or arranged on an inner side wall of the bracket. The electronic component is electrically coupled to the circuit board.